Multilayer ceramic electronic component including multilayer external electrodes

1. A multilayer ceramic electronic component comprising:

a multilayer body including:

a plurality of stacked ceramic layers;

a first main surface and a second main surface that face each other in a height direction;

a first side surface and a second side surface that face each other in a width direction orthogonal or substantially orthogonal to the height direction; and

a first end surface and a second end surface that face each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction;

a first internal electrode layer on a corresponding one of the plurality of ceramic layers and exposed at the first end surface;

a second internal electrode layer on a corresponding one of the plurality of ceramic layers and exposed at the second end surface;

a first external electrode connected to the first internal electrode layer and provided on the first end surface; and

a second external electrode connected to the second internal electrode layer and provided on the second end surface; wherein

the first external electrode includes:

a first underlying electrode layer on the first end surface of the multilayer body and including metal components and ceramic components; and

a plurality of first plating layers on the first underlying electrode layer;

the second external electrode includes:

a second underlying electrode layer on the second end surface of the multilayer body and including metal components and ceramic components; and

a plurality of second plating layers on the second underlying electrode layer;

a metal of a first plating layer on the first underlying electrode layer, of the plurality of first plating layers, diffuses into the first underlying electrode layer to extend from a surface layer of the first underlying electrode layer to an interface of the multilayer body, and exists at an interface where the metal components included in the first underlying electrode layer are in contact with each other, an interface where the metal component included in the first underlying electrode layer and the ceramic component included in the first underlying electrode layer are in contact with each other, and an interface between the metal component included in the first underlying electrode layer and the multilayer body; and

a metal of a second plating layer on the second underlying electrode layer, of the plurality of second plating layers, diffuses into the second underlying electrode layer to extend from a surface layer of the second underlying electrode layer to an interface of the multilayer body, and exists at an interface where the metal components included in the second underlying electrode layer are in contact with each other, an interface where the metal component included in the second underlying electrode layer and the ceramic component included in the second underlying electrode layer are in contact with each other, and an interface between the metal component included in the second underlying electrode layer and the multilayer body.

2. The multilayer ceramic electronic component according to claim 1 , wherein the metal components included in the first underlying electrode layer and the second underlying electrode layer are Ni.

3. The multilayer ceramic electronic component according to claim 1 , wherein the metal of the first plating layer on the first underlying electrode layer, of the plurality of first plating layers, and the metal of the second plating layer on the second underlying electrode layer, of the plurality of second plating layers, are Cu.

4. The multilayer ceramic electronic component according to claim 1 , wherein a dimension of the multilayer body in the length direction is equal to or more than about 0.2 mm and equal to or less than about 10.0 mm, a dimension of the multilayer body in the width direction is equal to or more than about 0.1 mm and equal to or less than about 10.0 mm, and a dimension of the multilayer body in the height direction is equal to or more than about 0.1 mm and equal to or less than about 5.0 mm.

5. The multilayer ceramic electronic component according to claim 1 , wherein the plurality of stacked ceramic layers include at least one of BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 as a main component.

6. The multilayer ceramic electronic component according to claim 5 , wherein the plurality of stacked ceramic layers further include a Mn compound, a Fe compound, a Cr compound, a Co compound, or a Ni compound as a sub-component.

7. The multilayer ceramic electronic component according to claim 1 , wherein the first and second internal electrode layers include at least one of Ni, Cu, Ag, Pd, or Au, or an alloy including at least one of Ni, Cu, Ag, Pd, or Au.

8. The multilayer ceramic electronic component according to claim 1 , wherein a thickness of each of the first and second internal electrode layer is equal to or more than about 0.2 μm and equal to or less than about 2.0 μm.

9. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body includes a plurality of the first internal electrode layers and a plurality of the second internal electrode layers.

10. The multilayer ceramic electronic component according to claim 1 , wherein a thickness of a central portion of each of the first and second underlying layers is equal to or more than about 3 μm and equal to or less than about 160 μm.

11. The multilayer ceramic electronic component according to claim 1 , wherein the metal components included in the first underlying electrode layer and the second underlying electrode layer are at least one of Cu, Ni, Ag, Pd, an Ag—Pd alloy, or Au.

12. The multilayer ceramic electronic component according to claim 11 , wherein the ceramic components of each of the first and second underlying electrode layers further are at least one of BaTiO 3 , CaTiO 3 , (Ba, Ca)TiO 3 , SrTiO 3 , CaZrO 3 .

13. The multilayer ceramic electronic component according to claim 1 , wherein

the plurality of first plating layers include a first intermediate plating layer on the first plating layer on the first underlying layer, and a first upper plating layer on the first intermediate plating layer; and

the plurality of second plating layers include a second intermediate plating layer on the second plating layer on the second underlying layer, and a second upper plating layer on the second intermediate plating layer.

14. The multilayer ceramic electronic component according to claim 13 , wherein each of the first intermediate plating layer, the first upper plating layer, the second intermediate layer, and the second upper plating layer includes at least one of Ni, Sn, Cu, Ag, Pd, an Ag—Pd alloy, or Au.