Ferroelectric field effect transistors (FeFETs) having band-engineered interface layer
Ferroelectric field effect transistors (FeFETs) having band-engineered interface layers are described. In an example, an integrated circuit structure includes a semiconductor channel layer above a substrate. A metal oxide material is on the semiconductor channel layer, the metal oxide material having no net dipole. A ferroelectric oxide material is on the metal oxide material. A gate electrode is on the ferroelectric oxide material, the gate electrode having a first side and a second side opposite the first side. A first source/drain region is at the first side of the gate electrode, and a second source/drain region is at the second side of the gate electrode.
1. An integrated circuit structure, comprising:
a semiconductor channel layer above a substrate;
an insulating layer intervening between the semiconductor channel layer and the substrate, wherein the semiconductor channel layer is directly on the insulating layer;
a metal oxide material on the semiconductor channel layer, the metal oxide material having no net dipole, and the metal oxide material having an uppermost surface;
a ferroelectric oxide material on the metal oxide material, the ferroelectric oxide material having an uppermost surface co-planar with the uppermost surface of the metal oxide material;
a gate electrode on the ferroelectric oxide material, the gate electrode having a first side and a second side opposite the first side, wherein a portion of the ferroelectric oxide material is on the first side and the second side of the gate electrode, wherein a portion of the metal oxide material is on the portion of the ferroelectric oxide material on the first side and the second side of the gate electrode, and wherein the gate electrode has an uppermost surface co-planar with the uppermost surface of the ferroelectric oxide material;
a first source/drain region at the first side of the gate electrode; and
a second source/drain region at the second side of the gate electrode.
2. The integrated circuit structure of claim 1 , wherein the metal oxide material is selected from the group consisting of magnesium oxide, lanthanum aluminum oxide and aluminum oxide.
3. The integrated circuit structure of claim 1 , wherein the semiconductor channel layer is a single crystalline semiconductor channel layer.
4. The integrated circuit structure of claim 1 , wherein the semiconductor channel layer is an amorphous or polycrystalline semiconductor channel layer.
5. The integrated circuit structure of claim 1 , wherein the ferroelectric oxide material is selected from the group consisting of lead zirconate titanate (PZT), strontium bismuth tantalum oxide (SBT), and lanthanum-doped lead zirconium titanate (PLZT).
6. The integrated circuit structure of claim 1 , wherein the ferroelectric oxide material comprises hafnium and oxygen.
7. The integrated circuit structure of claim 1 , wherein the integrated circuit structure is a two-state memory cell.
8. The integrated circuit structure of claim 1 , further comprising:
a non-volatile memory cell coupled to the second source/drain region, the non-volatile memory cell selected from the group consisting of a spin torque transfer random access memory (STTRAM) cell, a resistive random access memory (RRAM) cell, and a conductive bridge random access memory (CBRAM) cell.
9. An integrated circuit structure, comprising:
a semiconductor fin above a substrate, the semiconductor fin having a top and sidewalls;
an insulating layer intervening between the semiconductor fin and the substrate, wherein the semiconductor fin is directly on the insulating layer;
a metal oxide material on the top and sidewalls of the semiconductor fin, the metal oxide material having no net dipole, and the metal oxide material having an uppermost surface;
a ferroelectric oxide material on the metal oxide material on the top and sidewalls of the semiconductor fin, the ferroelectric oxide material having an uppermost surface co-planar with the uppermost surface of the metal oxide material;
a gate electrode on the ferroelectric oxide material above the top and laterally adjacent to the sidewalls of the semiconductor fin, the gate electrode having a first side and a second side opposite the first side, wherein a portion of the ferroelectric oxide material is on the first side and the second side of the gate electrode, wherein a portion of the metal oxide material is on the portion of the ferroelectric oxide material on the first side and the second side of the gate electrode, and wherein the gate electrode has an uppermost surface co-planar with the uppermost surface of the ferroelectric oxide material;
a first source/drain region at the first side of the gate electrode; and
a second source/drain region at the second side of the gate electrode.
10. The integrated circuit structure of claim 9 , wherein the metal oxide material is selected from the group consisting of magnesium oxide, lanthanum aluminum oxide and aluminum oxide.
11. The integrated circuit structure of claim 9 , wherein the semiconductor fin is a single crystalline semiconductor fin.
12. The integrated circuit structure of claim 9 , wherein the semiconductor fin is an amorphous or polycrystalline semiconductor fin.
13. The integrated circuit structure of claim 9 , wherein the ferroelectric oxide material is selected from the group consisting of lead zirconate titanate (PZT), strontium bismuth tantalum oxide (SBT), and lanthanum-doped lead zirconium titanate (PLZT).
14. The integrated circuit structure of claim 9 , wherein the ferroelectric oxide material comprises hafnium and oxygen.
15. The integrated circuit structure of claim 9 , wherein the integrated circuit structure is a two-state memory cell.
16. The integrated circuit structure of claim 9 , further comprising:
a non-volatile memory cell coupled to the second source/drain region, the non-volatile memory cell selected from the group consisting of a spin torque transfer random access memory (STTRAM) cell, a resistive random access memory (RRAM) cell, and a conductive bridge random access memory (CBRAM) cell.
17. An integrated circuit structure, comprising:
a semiconductor nanowire above a substrate, the semiconductor nanowire having a top, a bottom and sidewalls;
a metal oxide material on the top, bottom and sidewalls of the semiconductor nanowire, the metal oxide material having no net dipole, and the metal oxide material having an uppermost surface;
a ferroelectric oxide material on the metal oxide material on the top, bottom and sidewalls of the semiconductor nanowire, the ferroelectric oxide material having an uppermost surface co-planar with the uppermost surface of the metal oxide material;
a gate electrode on the ferroelectric oxide material above the top, below the bottom and laterally adjacent to the sidewalls of the semiconductor nanowire, the gate electrode having a first side and a second side opposite the first side, wherein a portion of the ferroelectric oxide material is on the first side and the second side of the gate electrode, wherein a portion of the metal oxide material is on the portion of the ferroelectric oxide material on the first side and the second side of the gate electrode, and wherein the gate electrode has an uppermost surface co-planar with the uppermost surface of the ferroelectric oxide material;
a first source/drain region at the first side of the gate electrode; and
a second source/drain region at the second side of the gate electrode.
18. The integrated circuit structure of claim 17 , wherein the metal oxide material is selected from the group consisting of magnesium oxide, lanthanum aluminum oxide and aluminum oxide.
19. The integrated circuit structure of claim 17 , wherein the semiconductor nanowire is a single crystalline semiconductor nanowire.
20. The integrated circuit structure of claim 17 , wherein the semiconductor nanowire is an amorphous or polycrystalline semiconductor nanowire.
21. The integrated circuit structure of claim 17 , wherein the ferroelectric oxide material is selected from the group consisting of lead zirconate titanate (PZT), strontium bismuth tantalum oxide (SBT), and lanthanum-doped lead zirconium titanate (PLZT).
22. The integrated circuit structure of claim 17 , wherein the ferroelectric oxide material comprises hafnium and oxygen.
23. The integrated circuit structure of claim 17 , wherein the integrated circuit structure is a two-state memory cell.
24. The integrated circuit structure of claim 17 , further comprising:
a non-volatile memory cell coupled to the second source/drain region, the non-volatile memory cell selected from the group consisting of a spin torque transfer random access memory (STTRAM) cell, a resistive random access memory (RRAM) cell, and a conductive bridge random access memory (CBRAM) cell.