Photocurable composition
The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan δ=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×10 5 Pa or less after curing. Component (A): urethane-modified (meth)acrylate oligomer Component (B): film forming agent Component (C): photoinitiator
1. A photocurable composition having a film shape at 25° C. in a state of not being cured, the photocurable composition comprising the following components (A) to (E), wherein
the photocurable composition contains 20 to 40 parts by mass of the component (B) with respect to 100 parts by mass of the component (A) and 0.1 to 10 parts by mass of the component (D) with respect to 100 parts by mass of the component (A),
a temperature of tan δ=1 is 30° C. to 50° C. before curing, and
a storage elastic modulus at 25° C. is 1.0×10 5 to 10.0×10 5 Pa or less when the photocurable composition is cured:
component (A): urethane-modified (meth)acrylate oligomer;
component (B): phenoxy resin of which a weight average molecular weight is 30,000 to 80,000; component (C): photoinitiator;
component (D): (meth)acrylate monomer that is different from the component (A); and
component (E): 3-Methacryloxypropyltrimethoxysilane,
wherein a weight average molecular of the component (A) is 20,000 to 40,000, and a (meth)acrylic group equivalent of the component (A) is 5000 to 25000 g/eq.
2. The photocurable composition having a film shape at 25° C. in a state of not being cured according to claim 1 , wherein the phenoxy resin is solid at 25° C. and does not have a (meth)acrylic group in a molecule.
3. The photocurable composition having a film shape at 25° C. in a state of not being cured according to claim 1 , wherein the (meth)acrylic group equivalent of the component (A) is 15000 to 25000 g/eq.
4. The photocurable composition having a film shape at 25° C. in a state of not being cured according to claim 1 , wherein the photocurable composition can be transferred to an adherend at 20° C. to 30° C.
5. A cured product obtained by curing the photocurable composition according to claim 1 .
6. A bonding method of two adherends, the method comprising transferring the photocurable composition having a film shape at 25° C. in a state of not being cured according to claim 1 to one adherend in an atmosphere of 20° C. to 30° C. and then transferring the photocurable composition to another adherend as well.
7. The bonding method according to claim 6 , wherein vacuum heating is performed on a laminate transferred to two adherends.
8. The bonding method according to claim 7 , wherein a temperature in vacuum heating is 30° C. to 60° C.
9. A stock solution comprising the following components (A) to (E) and a solvent, wherein the stock solution contains 20 to 40 by mass of the component (B) with respect to 100 parts by mass of the component (A) and 0.1 to 10 parts by mass of the component (D) with respect to 100 parts by mass of the component (A):
component (A): urethane-modified (meth)acrylate oligomer;
component (B): phenoxy resin of which a weight average molecular weight is 30,000 to 80,000; and
component (C): photoinitiator;
component (D): (meth)acrylate monomer that is different from the component (A); and
component (E): 3-Methacryloxypropyltrimethoxysilane, wherein a weight average molecular of the component (A) is 20,000 to 40,000 and a (meth)acrylic group equivalent of the component (A) is 5000 to 25000 g/eq.
10. A method for producing a photocurable composition having a film shape at 25° C. in a state of not being cured, the method comprising obtaining a photocurable composition having a film shape at 25° C. by volatilizing the solvent in the stock solution according to claim 9 .