IP Library › Granted Patent US 11,644,249
Granted Patent B2
US 11,644,249 · App. 17/040,731 · Granted May 9, 2023

Electronic apparatus

Inventors: Mahiro Hachiya (Tokyo, JP); Minoru Yoshikawa (Tokyo, JP)
Assignee: NEC CORPORATION
F28D15/04G06F1/20H01L23/427G06F2200/201H05K7/20336
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Quick Facts
Patent No.
US 11,644,249
App. No.
17/040,731
Granted
May 9, 2023
Kind
B2
Abstract

This electronic apparatus 100 comprises a heating element 20 , and a case 30 . The case 30 has an opening hole 31 . In order that a refrigerant COO will be sealed between the case 30 and the heating element 20 , the outer periphery part of a first heating element external surface 21 , which is the external surface of the heating element 20 , is attached to the outer periphery part of the opening hole 31 . Also, the refrigerant COO is a refrigerant that is capable of phase change from a liquid refrigerant LP-COO to a gas phase refrigerant GP-COO. As a result, it is possible to more efficiently cool the heat of the heating element 20.

Claims (15)

1. An electronic apparatus comprising:

a circuit board;

a heat-generating body mounted on the circuit board, an outer circumferential part of a heat-generating body outer surface being an outer surface of the heat-generating body facing away from the circuit board, and the heat-generating body is mounted on the circuit board;

an enclosure including an opening, the opening having an outer circumferential part or an inner circumferential part; and

a connecting part connecting the outer circumferential part of the heat-generating body outer surface to the outer circumferential part or the inner circumferential part of the opening in such a way that a coolant is configured to undergo a phase change between a liquid-phase of the coolant and a gas-phase of the coolant, the coolant is hermetically sealed between the enclosure and the heat-generating body by the connecting part, one end of the connecting part being attached to the outer circumferential part of the heat-generating body outer surface and another end of the connecting part being attached to the outer circumferential part or the inner circumferential part of the opening;

wherein the heat-generating body directly comes in contact with the liquid-phase of the coolant at the opening; and the connecting part is formed by an elastic member pressing the outer circumferential part of the heat-generating body outer surface, and the outer circumferential part or the inner circumferential part of the opening.

2. The electronic apparatus according to claim 1 , further comprising a coolant passage being provided on an inner surface of the enclosure from at least the opening up to above a surface of the liquid-phase of the coolant in a vertical direction, the coolant passage being formed in such a way that the liquid-phase of the coolant flows toward the heat-generating body.

3. The electronic apparatus according to claim 2 , wherein the coolant passage guides the liquid-phase of the coolant toward the heat-generating body by a capillary phenomenon.

4. The electronic apparatus according to claim 3 , wherein the coolant passage is formed by grooves or a porous body.

5. The electronic apparatus according to claim 1 , further comprising a coolant passage being provided on an inner surface of the connecting part from at least an outer circumferential part side of the heat-generating body outer surface up to above a surface of the liquid-phase of the coolant in a vertical direction and being formed in such a way that the liquid-phase of the coolant flows from the outer circumferential part or the inner circumferential part of the opening toward the outer circumferential part of the heat-generating body outer surface.

6. The electronic apparatus according to claim 5 , wherein the coolant passage guides the liquid-phase of the coolant by a capillary phenomenon.

7. The electronic apparatus according to claim 6 , wherein the coolant passage is formed by grooves or a porous body.

8. The electronic apparatus according to claim 1 , wherein the elastic member comprises a first coolant passage and a second coolant passage.

9. The electronic apparatus according to claim 1 , further comprising a boiling acceleration part being provided on the heat-generating body outer surface and accelerating the phase change of the liquid-phase of the coolant around the heat-generating body outer surface to the gas-phase of the coolant by heat of the heat-generating body.

10. The electronic apparatus according to claim 9 , wherein the boiling acceleration part is grooves or a porous body formed on the heat-generating body outer surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2023
From: HACHIYA, MAHIRO; YOSHIKAWA, MINORU
To: NEC CORPORATION
Reel/Frame 062952/0359 →
Priority Claims (1)
JP JP2018-071069 · Apr 2, 2018 · national
Continuity (1)
Related Publication 20210010757A1 · Jan 14, 2021