Method for FinFET fabrication and structure thereof
A semiconductor device includes a semiconductor substrate, a semiconductor fin protruding from the semiconductor substrate, and an isolation layer disposed above the semiconductor substrate. The isolation layer includes a first portion disposed on a first sidewall of the semiconductor fin and a second portion disposed on a second sidewall of the semiconductor fin. Top surfaces of the first and second portions of the isolation layer are leveled. The first portion of the isolation layer includes an air pocket. The semiconductor device also includes a dielectric fin with a bottom portion embedded in the second portion of the isolation layer.
1. A semiconductor device, comprising:
a semiconductor substrate;
a semiconductor fin protruding from the semiconductor substrate, wherein the semiconductor fin has a first sidewall and a second sidewall opposing the first sidewall;
an isolation layer disposed above the semiconductor substrate, wherein the isolation layer includes a first portion disposed on the first sidewall of the semiconductor fin and a second portion disposed on the second sidewall of the semiconductor fin, wherein top surfaces of the first and second portions of the isolation layer are leveled, and wherein the first portion of the isolation layer includes an air pocket; and
a dielectric fin, wherein a bottom portion of the dielectric fin is embedded in the second portion of the isolation layer.
2. The semiconductor device of claim 1 , wherein the second portion of the isolation layer is substantially free of air pockets.
3. The semiconductor device of claim 1 , wherein the air pocket has an opening at the top surface of the first portion of the isolation layer.
4. The semiconductor device of claim 3 , further comprising:
a gate structure engaging the semiconductor fin, wherein the opening of the air pocket is capped by a high-k gate dielectric layer of the gate structure.
5. The semiconductor device of claim 1 , wherein a bottommost portion of the air pocket is below a bottom surface of the dielectric fin.
6. The semiconductor device of claim 1 , wherein a width of the dielectric fin is larger than a width of the semiconductor fin.
7. The semiconductor device of claim 1 , further comprising:
a liner interposing the semiconductor fin and the isolation layer.
8. The semiconductor device of claim 1 , wherein the air pocket is a first air pocket and the dielectric fin includes a second air pocket.
9. The semiconductor device of claim 8 , wherein the second air pocket has an opening at a top surface of the dielectric fin.
10. The semiconductor device of claim 8 , wherein a height of the second air pocket is larger than a height of the first air pocket.
11. A semiconductor device, comprising:
a semiconductor substrate;
first, second, and third semiconductor fins extending from the semiconductor substrate;
a dielectric material layer disposed between the first and second semiconductor fins and between the second and third semiconductor fins, the dielectric material layer having a seam with an opening at a top surface of the dielectric material layer between the first and second semiconductor fins, the seam extending downwardly towards the semiconductor substrate; and
a dielectric fin disposed above the dielectric material layer and between the second and third semiconductor fins.
12. The semiconductor device of claim 11 , wherein a top surface of the dielectric material layer between the first and second semiconductor fins and a top surface of the dielectric material layer between the second and third semiconductor fins are coplanar.
13. The semiconductor device of claim 11 , wherein a bottom surface of the dielectric fin is below a top surface of the dielectric material layer.
14. The semiconductor device of claim 11 , wherein a spacing between the second and third semiconductor fins is greater than a spacing between the first and second semiconductor fins.
15. The semiconductor device of claim 14 , wherein the spacing between the second and third semiconductor fins is at least twice of the spacing between the first and second semiconductor fins.
16. The semiconductor device of claim 11 , wherein the dielectric fin has another seam with an opening at a top surface of the dielectric fin and extending downwardly towards the semiconductor substrate.
17. The semiconductor device of claim 16 , further comprising:
a gate stack over the first, second, and third semiconductor fins and the dielectric fin, wherein the openings of the seams are both capped by the gate stack.
18. A semiconductor device, comprising:
a semiconductor substrate;
first and second semiconductor fins extending from the semiconductor substrate;
an isolation feature disposed between the first and second semiconductor fins;
a dielectric fin disposed between the first and second semiconductor fins, wherein a bottom portion of the dielectric fin is embedded in the isolation feature; and
a gate stack over the dielectric fin and engaging the first and second semiconductor fins, wherein the gate stack seals a seam positioned in a top portion of the dielectric fin.
19. The semiconductor device of claim 18 , wherein the seam has an aspect ratio less than about 8:1.
20. The semiconductor device of claim 18 , wherein a bottommost portion of the seam is below a top surface of the isolation feature.