Electroplating apparatus and electroplating method using the same

1. An electroplating apparatus, comprising:

a plating bath;

a substrate in a horizontal direction;

a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate;

an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction; and

a controller sensing a position of the anode, the controller configured to control a power supply circuit to regulate a voltage to be applied to the plurality of cathodes based on an area of plating on the substrate corresponding to the position of the anode,

wherein the power supply circuit is regulated to apply a direct current voltage to the anode, an alternating current voltage to the plurality of cathodes, and a same voltage to a first cathode and a second cathode disposed facing each other among the plurality of cathodes,

wherein a sum of the current flowing between the anode and the first cathode and the second cathode disposed facing each other among the plurality of cathodes is constant,

wherein the anode includes a plurality of sub-anodes disposed in a matrix on a plane, and an insulating layer disposed between the plurality of sub-anodes has a mesh form, and

wherein, in operation, the plurality of sub-anodes are separately applied with respective voltages to obtain a profile having a current density in a central portion of the anode that is uniform.

2. The electroplating apparatus of claim 1 , wherein the plurality of cathodes includes:

a plurality of first cathodes on the first side of the substrate;

a plurality of second cathodes on a the second side of the substrate, the second side opposing the first side; and

each of the plurality of first cathodes is configured to correspond to each of the plurality of second cathodes.

3. The electroplating apparatus of claim 2 , wherein

the power supply circuit is electrically connected to the plurality of cathodes and the anode to apply a current.

4. The electroplating apparatus of claim 1 , wherein a length of the anode in the first direction is shorter than a length of the anode in a second direction perpendicular to the first direction on the surface of the substrate.

5. The electroplating apparatus of claim 4 , wherein the plurality of sub-anodes are spaced apart from each other.

6. The electroplating apparatus of claim 1 , further comprising a stage in the horizontal direction in the plating bath and configured to support the substrate.

7. A horizontal electroplating apparatus, comprising:

a plating bath having a space configured to be filled with a plating solution;

a plurality of first cathodes and a plurality of second cathodes disposed to face each other in the plating bath and configured to apply different current densities to respective plating regions;

an anode overlying the plurality of first cathodes and the plurality of second cathodes, the anode being configured to be movable between the plurality of first cathodes and the plurality of second cathodes; and

a controller sensing a position of the anode, the controller configured to control a power supply circuit to regulate a voltage to be applied to the plurality of first cathodes and the plurality of second cathodes based on the plating region on the substrate corresponding to the position of the anode,

wherein the power supply circuit is regulated to apply a direct current voltage to the anode, an alternating current voltage to the plurality of first cathodes and the plurality of second cathodes, and a same voltage to a first cathode and a second cathode disposed facing each other among the plurality of first cathodes and the plurality of second cathodes,

wherein a sum of the current flowing between the anode and the first cathode and the second cathode disposed facing each other among the plurality of first cathodes and the plurality of second cathodes is constant,

wherein the anode includes a plurality of sub-anodes disposed in a matrix on a plane, and an insulating layer disposed between the plurality of sub-anodes has a mesh form, and wherein, in operation, the plurality of sub-anodes are separately applied with respective voltages to obtain a profile having a current density in a central portion of the anode that is uniform.

8. The horizontal electroplating apparatus of claim 7 , wherein when the space of the plating bath is filled with the plating solution, a virtual plane in which the plurality of first cathodes and the plurality of second cathodes are disposed being parallel to a surface of the plating solution.

9. The horizontal electroplating apparatus of claim 7 , further comprising:

a substrate including a seed pattern in contact with the plurality of first cathodes and the plurality of second cathodes, the substrate being in the plating bath, and

when the plating bath is filled with the plating solution, a surface of the plating solution is parallel to a surface of the substrate.

10. The horizontal electroplating apparatus of claim 7 , wherein

the power supply circuit is electrically connected to the plurality of first cathodes, the plurality of second cathodes, and the anode to apply a current.

11. The horizontal electroplating apparatus of claim 7 , wherein the plurality of sub-anodes are spaced apart from each other.

12. A horizontal electroplating apparatus, comprising:

a plating bath configured to hold a plating solution and configured to hold a substrate including a plurality of plating regions;

a plurality of first cathodes and a plurality of second cathodes disposed on opposing sides of the plating bath and configured to apply different current densities to respective ones of the plurality of plating regions;

an anode overlying the plurality of first cathodes and the plurality of second cathodes, the anode configured to move between the plurality of first cathodes and the plurality of second cathodes; and

a controller sensing a position of the anode, the controller configured to control a power supply circuit to regulate a voltage to be applied to the plurality of first cathodes and the plurality of second cathodes based on the plating region on the substrate corresponding to the position of the anode,

wherein the power supply circuit is regulated to apply a direct current voltage to the anode, an alternating current voltage to the plurality of first cathodes and the plurality of second cathodes, and a same voltage to a first cathode and a second cathode disposed facing each other among the plurality of first cathodes and the plurality of second cathodes,

wherein a sum of the current flowing between the anode and the first cathode and the second cathode disposed facing each other among the plurality of first cathodes and the plurality of second cathodes is constant,

wherein the anode includes a plurality of sub-anodes disposed in a matrix on a plane, and an insulating layer disposed between the plurality of sub-anodes has a mesh form, and

wherein, in operation, the plurality of sub-anodes are separately applied with respective voltages to obtain a profile having a current density in a central portion of the anode that is uniform.

13. The horizontal electroplating apparatus of claim 12 , wherein the plurality of first cathodes are configured to contact a first side of the substrate and the plurality of second cathodes are configured to contact a second side of the substrate.

14. The horizontal electroplating apparatus of claim 12 , wherein the plurality of first cathodes are configured to receive a first current and plurality of second cathodes are configured to receive a second current, and wherein a sum of the first and second currents is a constant.