Hybrid thermal cooling system
Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.
1. An electronic device comprising:
a heat source;
an air mover having a first outlet and a second outlet;
a first heat sink coupled to the first outlet of the air mover, wherein a first stream of exhaust air from the air mover moves over and/or through the first heat sink;
a second heat sink coupled to the second outlet of the air mover, wherein a second stream of exhaust air from the air mover moves over and/or through the second heat sink;
a thermal electric cooling device (TEC) adjacent to the air mover and disposed over the second heat sink; and
a heat pipe, wherein the heat pipe couples the heat source to the first heat sink and to the TEC and transfers heat from the heat source to the first heat sink and to the TEC.
2. The electronic device of claim 1 , wherein the heat pipe includes:
a first heat pipe that couples the heat source to the first heat sink; and
a second heat pipe that couples the heat source to the TEC.
3. The electronic device of claim 1 , wherein the second heat sink removes heat from the TEC.
4. The electronic device of claim 1 , further comprising:
a TEC heat pipe, wherein the TEC heat pipe couples the TEC to the second heat sink.
5. The electronic device of claim 1 , further comprising:
a thermal management engine, wherein the thermal management engine controls the air mover and the TEC.
6. The electronic device of claim 1 , wherein the heat pipe is coupled to a first side of the TEC and the second heat sink is coupled to a second side of the TEC, wherein the first side of the TEC is opposite the second side of the TEC.
7. A system for thermal management of one or more heat sources, the system comprising:
an air mover having a first outlet and a second outlet;
a first heat sink coupled to the first outlet of the air mover, wherein exhaust air from the air mover moves over and/or through the first heat sink;
a second heat sink coupled to the second outlet of the air mover, wherein exhaust air from the air mover moves over and/or through the second heat sink;
a thermal electric cooling device (TEC) adjacent to the air mover and over the second heat sink; and
a heat pipe, wherein the heat pipe couples at least one heat source from the one or more heat source to the first heat sink and to the TEC and transfers heat from the at least one heat source to the first heat sink and to the TEC.
8. The system of claim 7 , wherein a thermal management engine controls the air mover and the TEC.
9. The system of claim 7 , further comprising:
a TEC heat pipe, wherein the TEC heat pipe couples the TEC to the second heat sink.
10. The system of claim 7 , further comprising:
a second heat source, wherein the heat pipe couples the second heat source to the air mover and the TEC and transfers heat from the second heat source to the air mover and the TEC.
11. An electronic device comprising:
a heat source;
an air mover having a first outlet and a second outlet;
a first heat sink coupled to the first outlet of the air mover, wherein a first stream of exhaust air from the air mover moves over and/or through the first heat sink;
a second heat sink coupled to the second outlet of the air mover, wherein a second stream of exhaust air from the air mover moves over and/or through the second heat sink;
a thermal electric cooling device (TEC) adjacent to the air mover;
a heat pipe, wherein the heat pipe couples the heat source to the first heat sink and to the TEC and transfers heat from the heat source to the first heat sink and to the TEC; and
a second heat source, wherein the heat pipe couples the second heat source to the second heat sink and to the TEC and transfers heat from the second heat source to the second heat sink and to the TEC.
12. The electronic device of claim 11 , wherein the heat pipe includes:
a first heat pipe that couples the heat source to the first heat sink; and
a second heat pipe that couples the heat source to the TEC.
13. The electronic device of claim 11 , wherein the second heat sink removes heat from the TEC.
14. The electronic device of claim 11 , further comprising:
a TEC heat pipe, wherein the TEC heat pipe couples the TEC to the second heat sink.
15. The electronic device of claim 11 , further comprising:
a thermal management engine, wherein the thermal management engine controls the air mover and the TEC.
16. The electronic device of claim 11 , wherein the TEC is disposed over the second heat sink.
17. The electronic device of claim 11 , wherein the heat pipe is coupled to a first side of the TEC and the second heat sink is coupled to a second side of the TEC, wherein the first side of the TEC is opposite the second side of the TEC.