Method and system for map-free inspection of semiconductor devices

1. A method for defect detection in a hole array on a substrate, comprising:

scanning a substrate surface using at least one optical detector,

generating at least one image of the substrate surface; and

analyzing the at least one image to detect defects in the hole array on the substrate surface based on a comparison between at least one first distance and a second distance, wherein

the at least one first distance is determined based on at least one actual edge of the hole array and a center of a theoretical hole model, and

the second distance is determined based on a radius of the theoretical hole model.

2. The method of claim 1 , wherein the scanning further comprises:

transporting the at least one optical detector using a transport mechanism.

3. The method of claim 2 , wherein the transport mechanism comprises at least one linear motor.

4. The method of claim 1 , wherein each of the at least one optical detector comprises a line scan camera, wherein the line scan camera scans the substrate surface one pixel line at a time.

5. The method of claim 1 , wherein the generating further comprises:

providing pixel data from the optical detector to a local processor coupled to the optical detector;

generating the at least one image of the substrate surface by processing the pixel data; and

displaying the at least one image of the substrate surface on a display monitor coupled to the local processor.

6. The method of claim 1 , further comprising:

illuminating the wafer surface using a light source.

7. The method of claim 6 , wherein the light source comprises a line light source that only illuminates a line portion of the substrate surface at one time.

8. An inspection station for defect detection in a hole array on a substrate, comprising:

at least one optical detector configured to scan a substrate surface and generate at least one image of the substrate surface;

a transport mechanism configured to transport the at least one optical detector so as to scan the substrate surface; and

at least one processor configured to receive the at least one image from the at least one optical detector and analyze the at least one image to detect defects on the substrate surface based on a comparison between at least one first distance and a second distance, wherein

the at least one first distance is determined based on at least one actual edge of the hole array and a center of a theoretical hole model, and

the second distance is determined based on a radius of the theoretical hole model.

9. The system of claim 8 , wherein each of the at least one optical detector comprises a line scan camera, wherein the line scan camera scans the substrate surface one pixel line at a time.

10. The system of claim 8 , wherein the transport mechanism comprises at least one linear motor.

11. The system of claim 8 , further comprising:

a light source to illuminate the wafer surface.

12. The system of claim 11 , wherein the light source comprises a line light source that only illuminates a line portion of the wafer surface at one time.

13. The system of claim 8 , wherein each of the at least one processor is configured to:

receive a pixel data from the at least one optical detector;

preprocess the pixel data to regenerate the at least one image of the substrate surface; and

display the at least one image of the substrate surface on a display monitor.

14. The system of claim 8 , wherein the at least one processor is further configured to:

receive the at least one image of the substrate surface; and

analyze the at least one image of the substrate surface.

15. A system for defect detection in a hole array on a substrate, comprising:

a first processing station for performing a first semiconductor manufacturing process;

a second processing station for performing a second semiconductor manufacturing process;

an inspection station coupled between the first and the second processing station for transporting the substrate between the first and the second processing stations, wherein the inspection station comprises:

at least one optical detector configured to scan a substrate surface and generate at least one image of the substrate surface;

a transport mechanism configured to transport the at least one optical detector so as to scan the substrate surface; and

at least one processor configured to receive the at least one image from the at least one optical detector and analyze the at least one image to detect defects on the substrate surface based on a comparison between at least one first distance and a second distance, wherein

the at least one first distance is determined based on at least one actual edge of the hole array and a center of a theoretical hole model, and

the second distance is determined based on a radius of the theoretical hole model.

16. The system of claim 15 , wherein each of the at least one optical detector comprises a line scan camera, wherein the line scan camera scans the substrate surface one pixel line at a time.

17. The system of claim 15 , wherein the transport mechanism comprises at least one linear motor.

18. The system of claim 15 , further comprising:

a light source to illuminate the substrate surface, wherein the light source comprises a line light source that only illuminates a line portion of the substrate surface at one time.

19. The system of claim 15 , wherein each of the at least one processor is configured to:

receive a pixel data from the at least one optical detector;

preprocess the pixel data to obtain the at least one image of the substrate surface; and

display the at least one image of the substrate surface on a display monitor.

20. The system of claim 15 , wherein the at least one processor is further configured to:

receive the at least one image of the substrate surface; and

analyze the at least one image of the substrate surface.