Semiconductor package with improved clamp
View Patent ↗Provided herein are semiconductor packages with improved clamps. In some embodiments, a semiconductor package may include a housing having a wall extending from a main body, and a set of support walls extending from the wall. The semiconductor package may further include a clamp extending between the set of support walls, the clamp having a first planar section coupled to a first support wall of the set of support walls, a second planar section coupled to a second support wall of the set of support walls, and a third planar section between the first and second planar sections. The third planar section may include an opening operable to receive a fastener, and a plurality of stress relief openings.
1. A semiconductor package, comprising:
a housing, comprising:
a wall extending from a main body; and
a set of support walls extending from the wall; and
a clamp extending between the set of support walls, the clamp comprising:
a first planar section coupled to a first support wall of the set of support walls, the first planar section comprising a first width;
a second planar section coupled to a second support wall of the set of support walls, the second planar section comprising the first width; and
a third planar section between the first and second planar sections, the third planar section including an opening operable to receive a fastener, and a plurality of stress relief openings, the third planar section comprising a second width, wherein the second width is greater than the first width;
wherein the first planar section and the second planar section are spaced apart from the third planar section along a direction perpendicular to a plane defined by an upper surface of the third planar section.
2. The semiconductor package of claim 1 , the clamp further comprising:
a first angled portion connecting the third planar section to the first planar section; and
a second angled portion connecting the third planar section to the second planar section.
3. The semiconductor package of claim 1 , the clamp further comprising at least one attachment opening formed through the first planar section or the second planar section.
4. The semiconductor package of claim 1 , wherein each of the plurality of stress relief openings is defined by a first edge having a curved profile and a second edge having a straight profile.
5. The semiconductor package of claim 1 , the third planar section including a central ring, wherein an interior edge of the central ring defines the opening.
6. The semiconductor package of claim 1 , the wall comprising a pair of end walls and a pair of sidewalls, wherein the pair of end walls and the pair of sidewalls extend perpendicularly from the main body.
7. The semiconductor package of claim 6 , wherein the set of support walls extend perpendicularly from the pair of end walls or the pair of sidewalls.
8. The semiconductor package of claim 1 , the housing further comprising a plurality of terminal openings formed through the main body.
9. A power semiconductor package, comprising:
a housing, comprising:
a wall extending from a main body; and
a first set of support walls and a second set of support walls extending from the wall; and
a first clamp extending between the first set of support walls and a second clamp extending between the second set of support walls, each of the first and second clamps comprising:
a first planar section coupled to a first support wall of the set of support walls, the first planar section comprising a first width;
a second planar section coupled to a second support wall of the set of support walls, the second planar section comprising the first width; and
a third planar section between the first and second planar sections, the third planar section including an opening operable to receive a fastener, and a plurality of stress relief openings, the third planar section comprising a second width, wherein the second width is greater than the first width;
wherein the first planar section and the second planar section are spaced apart from the third planar section along a direction perpendicular to a plane defined by an upper surface of the third planar section.
10. The power semiconductor package of claim 9 , each of the first and second clamps further comprising:
a first angled portion connecting the third planar section to the first planar section; and
a second angled portion connecting the third planar section to the second planar section.
11. The power semiconductor package of claim 9 , each of the first and second clamps further comprising at least one attachment opening formed through the first planar section or the second planar section.
12. The semiconductor package of claim 9 , wherein each of the plurality of stress relief openings is defined by a first edge having a curved profile and a second edge having a straight profile.
13. The semiconductor package of claim 9 , the third planar section including a central ring, wherein an interior edge of the central ring defines the opening.
14. The semiconductor package of claim 9 , the wall comprising a pair of end walls and a pair of sidewalls, wherein the pair of end walls and the pair of sidewalls extend perpendicularly from the main body.
15. An assembly, comprising:
a heatsink;
a power semiconductor module coupled to the heatsink, the power semiconductor module comprising:
a housing including a wall extending from a main body and a set of support walls extending from the wall; and
a clamp extending between the set of support walls, the clamp comprising:
a first planar section coupled to a first support wall of the set of support walls, the first planar section comprising a first width;
a second planar section coupled to a second support wall of the set of support walls, the second planar section comprising the first width; and
a third planar section between the first and second planar sections, the third planar section including an opening operable to receive a fastener, and a plurality of stress relief openings, the third planar section comprising a second width, wherein the second width is greater than the first width;
wherein the first planar section and the second planar section are spaced apart from the third planar section along a direction perpendicular to a plane defined by an upper surface of the third planar section.
16. The assembly of claim 15 , the clamp further comprising:
a first angled portion connecting the third planar section to the first planar section; and
a second angled portion connecting the third planar section to the second planar section.
17. The assembly of claim 15 , the clamp further comprising at least one attachment opening formed through the first planar section and the second planar section.
18. The assembly of claim 15 , wherein each of the plurality of stress relief openings is defined by a first edge having a curved profile and a second edge having a straight profile, wherein the opening through the third planar section is defined by an interior edge of a central ring.
19. The assembly of claim 15 , the wall comprising a pair of end walls and a pair of sidewalls, wherein the pair of end walls and the pair of sidewalls extend perpendicularly from the main body, and wherein the set of support walls extend perpendicularly from the pair of end walls or the pair of sidewalls.