Trench capacitor assembly for high capacitance density
Certain aspects of the present disclosure provide a capacitor assembly, a stacked capacitor assembly, an integrated circuit (IC) assembly comprising such a stacked capacitor assembly, and methods for fabricating the same. One exemplary capacitor assembly generally includes a first array of trench capacitors and a second array of trench capacitors. The second array of trench capacitors may be disposed adjacent to and electrically coupled to the first array of trench capacitors. Additionally, the second array of trench capacitors may be inverted with respect to the first array of trench capacitors.
1. A capacitor assembly comprising:
a first array of trench capacitors; and
a second array of trench capacitors disposed adjacent to and electrically coupled to the first array of trench capacitors, the second array of trench capacitors being inverted with respect to the first array of trench capacitors.
2. The capacitor assembly of claim 1 , wherein the first array of trench capacitors is disposed in a first substrate and wherein the second array of trench capacitors is disposed in a second substrate, different from the first substrate.
3. The capacitor assembly of claim 1 , wherein the trench capacitors in the first array are coupled in parallel to effectively form a first capacitive element having a first port and a second port.
4. The capacitor assembly of claim 3 , wherein the trench capacitors in the second array are coupled in parallel to effectively form a second capacitive element having a first port and a second port.
5. The capacitor assembly of claim 4 , wherein the first port of the first capacitive element is coupled to the first port of the second capacitive element and wherein the second port of the first capacitive element is coupled to the second port of the second capacitive element, such that the first capacitive element is coupled in parallel with the second capacitive element.
6. The capacitor assembly of claim 4 , further comprising a molding disposed between the first array of trench capacitors and the second array of trench capacitors.
7. The capacitor assembly of claim 6 , wherein the molding comprises a resin.
8. The capacitor assembly of claim 6 , further comprising a through-molding via (TMV) disposed in the molding, wherein the TMV is coupled to the second port of the first capacitive element and to the second port of the second capacitive element.
9. The capacitor assembly of claim 1 , further comprising:
at least one first contact extending above a top surface of the capacitor assembly; and
at least one second contact extending below a bottom surface of the capacitor assembly.
10. The capacitor assembly of claim 1 , further comprising a first molding disposed between the first array of trench capacitors and the second array of trench capacitors.
11. The capacitor assembly of claim 10 , further comprising at least one of:
a second molding disposed at an end of the first array of trench capacitors furthest away from the second array of trench capacitors; or
a third molding disposed at an end of the second array of trench capacitors furthest away from the first array of trench capacitors.
12. The capacitor assembly of claim 1 , wherein the first array of trench capacitors and the second array of trench capacitors have a same number of trench capacitors.