Printed wiring board and manufacturing method thereof
A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μn or greater to smaller than 8.5 μm.
1. A printed wiring board comprising:
a base film having insulation properties; and
a conductive pattern including a plurality of wiring portions laminated, the conductive pattern running on at least one surface of the base film,
wherein each wiring portion includes a first conductive portion having a lateral surface that faces another wiring portion that is adjacent to the each wiring portion and a second conductive portion coating an outer surface including the lateral surface of the first conductive portion,
wherein an average width of each wiring portion is 10 μm or greater and 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater and smaller than 8.5 μm, and
wherein the first conductive portion includes a conductive foundation layer laminated on the at least one surface of the base film, and an average thickness of the conductive foundation layer is 50 nm or greater and 2 μm or smaller.
2. The printed wiring board according to claim 1 ,
wherein an average interval of each wiring portion is 3 μm or greater and 20 μm or smaller.
3. The printed wiring board according to claim 1 ,
wherein a ratio of an average width of an upper surface to an average width of a bottom surface of the first conductive portion is 0.5 or greater and 1.0 or smaller, and
a ratio of the average width of an upper surface to an average width of a bottom surface of each wiring portion is 0.7 or greater and 1.5 or smaller.
4. The printed wiring board according to claim 1 ,
wherein a ratio of an average height of each wiring portion to an average height of the first conductive portion is 1.05 or greater and 5 or smaller.
5. The printed wiring board according to claim 1 ,
wherein a side view of an outer shape of the first conductive pattern is substantially a divergent trapezoidal shape.
6. The printed wiring board according to claim 1 ,
wherein a side view of an inner shape of the second conductive portion is substantially a divergent trapezoidal shape.
7. A printed wiring board comprising:
a base film having insulation properties; and
a conductive pattern including a plurality of wiring portions laminated, the conductive pattern running on at least one surface of the base film,
wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion,
wherein an average width of each wiring portion is 10 μm or greater and 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater and smaller than 8.5 μm, and
wherein the first conductive portion includes a conductive foundation layer laminated on the at least one surface of the base film, and an average thickness of the conductive foundation layer is 50 nm or greater and 2 μm or smaller, said first conductive portion having an average height of 15 μm or greater and 95 μm or smaller.