Conductive plate stress reduction feature

1. A packaged electronic device, comprising:

a semiconductor die having a first side, an opposite second side and a terminal exposed along the second side of the semiconductor die;

a conductive plate having a first side, an opposite second side and an indent, the indent extends into the first side, the conductive plate electrically coupled to a lead;

a solder structure that extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal exposed along the second side of the semiconductor die, the solder structure extends into the indent; and

a package structure that encloses the semiconductor die, the conductive plate and a portion of the lead, the package structure exposes a portion of the lead.

2. The packaged electronic device of claim 1 , wherein the indent includes a step that extends into the first side of the conductive plate.

3. The packaged electronic device of claim 2 , wherein:

the step extends into the first side of the conductive plate by a first distance; and

the indent includes a second step adjacent the step, the second step extends into the first side of the conductive plate by a second distance, and the second distance is greater than the first distance.

4. The packaged electronic device of claim 3 , wherein:

the second step extends to a lateral edge of the conductive plate; and

the solder structure extends laterally to the lateral edge of the conductive plate between the second side of the semiconductor die and the first side of the conductive plate.

5. The packaged electronic device of claim 1 , further comprising:

a second semiconductor die having a first side, an opposite second side, a first terminal, and a second terminal, the first terminal exposed along the first side of the second semiconductor die, and the second terminal exposed along the second side of the second semiconductor die;

a second conductive plate having a first side, an opposite second side and a second indent, the second indent extends into the first side, the second conductive plate electrically coupled to a second lead;

a second solder structure that extends between the first side of the second semiconductor die and the second side of the conductive plate to electrically couple the conductive plate to the first terminal of the second semiconductor die; and

a third solder structure that extends between the second side of the second semiconductor die and the first side of the second conductive plate to electrically couple the second conductive plate to the first terminal of the second semiconductor die, the third solder structure extends into the second indent;

wherein the package structure encloses the second semiconductor die, the second conductive plate and a portion of the second lead, and the package structure exposes a portion of the second lead.

6. The packaged electronic device of claim 5 , wherein the second indent includes a step that extends into the first side of the second conductive plate.

7. The packaged electronic device of claim 6 , wherein:

the step extends into the first side of the second conductive plate by a first distance; and

the second indent includes a second step adjacent the step, the second step extends into the first side of the second conductive plate by a second distance, and the second distance is greater than the first distance.

8. A method of manufacturing a packaged electronic device, the method comprising:

forming an indent in a side of a conductive plate;

depositing solder on a side of a semiconductor die;

engaging the side of the conductive plate with the solder to form a solder structure that extends between the side of the semiconductor die and the side of the conductive plate, the solder structure extends into the indent;

heating the solder to electrically couple the conductive plate to a terminal exposed along the side of the semiconductor die; and

forming a package structure that encloses the semiconductor die and the conductive plate.

9. The method of claim 8 , wherein forming the indent in the side of the conductive plate comprises:

forming a step that extends into the first side of the conductive plate.

10. The method of claim 9 , wherein:

the step extends into the first side of the conductive plate by a first distance; and

forming the indent in the side of the conductive plate further comprises forming a second step adjacent the step, the second step extends into the first side of the conductive plate by a second distance, and the second distance is greater than the first distance.

11. The method of claim 10 , wherein:

the second step extends to a lateral edge of the conductive plate; and

the solder structure extends laterally to the lateral edge of the conductive plate between the side of the semiconductor die and the side of the conductive plate.

12. The method of claim 8 , further comprising:

forming a second indent in a side of a second conductive plate;

depositing a second solder on a second side of the conductive plate;

engaging a first side of a second semiconductor die with the second solder to form a second solder structure that extends between the first side of the second semiconductor die and the second side of the conductive plate;

depositing a third solder on a second side of the second semiconductor die;

engaging the side of the second conductive plate with the third solder to form a third solder structure that extends between the second side of the second semiconductor die and the side of the second conductive plate, the third solder structure extends into the second indent;

heating the second solder and the third solder to electrically couple the conductive plate to a first terminal exposed along the first side of the second semiconductor die, and to electrically couple the second conductive plate to a second terminal of the second semiconductor die.

13. The method of claim 12 , wherein forming the second indent in the side of a second conductive plate comprises:

forming a step that extends into the side of the second conductive plate.

14. The method of claim 13 , wherein:

the step extends into the side of the second conductive plate by a first distance; and

forming the second indent in the side of the second conductive plate further comprises forming a second step adjacent the step, the second step extends into the side of the second conductive plate by a second distance, and the second distance is greater than the first distance.

15. A conductive plate, comprising:

a first portion having a first side in a first plane and an opposite second side in a second plane, the first and second planes parallel to one another, and the second side spaced apart from the first side along a direction orthogonal to the first and second planes;

a leg portion extending along a leg direction from the first portion past the first plane and away from the second plane; and

an indent that extends into the first side of the first portion along the direction.

16. The conductive plate of claim 15 , wherein the indent includes a step that extends into the first side of the conductive plate.

17. The conductive plate of claim 16 , wherein:

the step extends into the first side of the first portion of the conductive plate by a first distance; and

the indent includes a second step adjacent the step, the second step extends into the first side of the first portion of the conductive plate by a second distance, and the second distance is greater than the first distance.

18. The conductive plate of claim 15 , wherein the second step extends to a lateral edge of the conductive plate.

19. The conductive plate of claim 15 , wherein the leg direction is parallel to the direction.

20. The conductive plate of claim 15 , wherein the leg direction is at a non-zero angle to the direction.

21. A packaged electronic device, comprising:

a conductive plate having a first side, an opposite second side and an indent, the indent extends into a first side of a semiconductor die, the conductive plate electrically coupled to a lead;

a solder structure that extends between a second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal exposed along the second side of the semiconductor die, the solder structure extends into the indent; and

a package structure that encloses the semiconductor die, the conductive plate and a portion of the lead, the package structure exposes a portion of the lead.

22. The packaged electronic device of claim 21 , wherein the indent includes a step that extends into the first side of the conductive plate.

23. The packaged electronic device of claim 22 , wherein:

the step extends into the first side of the conductive plate by a first distance; and

the indent includes a second step adjacent the step, the second step extends into the first side of the conductive plate by a second distance, and the second distance is greater than the first distance.

24. The packaged electronic device of claim 23 , wherein:

the second step extends to a lateral edge of the conductive plate; and

the solder structure extends laterally to the lateral edge of the conductive plate between the second side of the semiconductor die and the first side of the conductive plate.

25. The packaged electronic device of claim 21 , further comprising:

a second semiconductor die having a first side, an opposite second side, a first terminal, and a second terminal, the first terminal exposed along the first side of the second semiconductor die, and the second terminal exposed along the second side of the second semiconductor die;

a second conductive plate having a first side, an opposite second side ( 128 ) and a second indent, the second indent extends into the first side, the second conductive plate electrically coupled to a second lead;

a second solder structure that extends between the first side of the second semiconductor die and the second side of the conductive plate to electrically couple the conductive plate to the first terminal of the second semiconductor die; and

a third solder structure that extends between the second side of the second semiconductor die and the first side of the second conductive plate to electrically couple the second conductive plate to the first terminal of the second semiconductor die, the third solder structure extends into the second indent;

wherein the package structure encloses the second semiconductor die, the second conductive plate and a portion of the second lead, and the package structure exposes a portion of the second lead.

26. The packaged electronic device of claim 25 , wherein the second indent includes a step that extends into the first side of the second conductive plate.

27. The packaged electronic device of claim 26 , wherein:

the step extends into the first side of the second conductive plate by a first distance; and

the second indent includes a second step adjacent the step, the second step extends into the first side of the second conductive plate by a second distance, and the second distance is greater than the first distance.

28. The packaged electronic device of claim 1 , wherein the indent occupies a portion of the first side and a portion of another side of the conductive plate.

29. The method of claim 8 , wherein the indent occupies a portion of the first side and a portion of another side of the conductive plate.

30. The conductive plate of claim 15 , wherein the indent occupies a portion of the first side and a portion of another side of the conductive plate.