Die-to-wafer bonding structure and semiconductor package using the same

1. A method of forming a substrate bonding structure, the method comprising:

preparing a first substrate comprising a first metal pad, a first bonding pad on the first metal pad and penetrating a first insulating layer, and a first polymer layer surrounding all side surfaces of the first bonding pad;

preparing a second substrate comprising a second metal pad, a second bonding pad on the second metal pad and penetrating a second insulating layer, and a second polymer layer surrounding all side surfaces of the second bonding pad; and

bonding the first substrate and the second substrate such that the first bonding pad contacts the second bonding pad and the first polymer layer contacts the second polymer layer.

2. The method of claim 1 , wherein, in the bonding of the first substrate and the second substrate, the first polymer layer on the first substrate is coupled to the second polymer layer on the second substrate to form a polymer layer.

3. The method of claim 2 , wherein the polymer layer entirely surrounds a side surface of the first insulating layer, a side surface of the second insulating layer, and surfaces of the first insulating layer and the second insulating layer facing each other.

4. The method of claim 1 , wherein, when viewed in cross-section, a width of the first metal pad is greater than a width of the first bonding pad, and

a width of the second metal pad is greater than a width of the second bonding pad.

5. The method of claim 1 , wherein a material constituting the first and second metal pads is different from a material constituting the first and second bonding pads.

6. The method of claim 1 , further comprising, in the preparing of the first substrate, performing a test by contacting the first metal pad with a test pin of a test device.

7. The method of claim 6 , wherein the first metal pad comprises a plurality of first metal pads,

the first bonding pad is not disposed on at least one of the plurality of first metal pads, and

an uneven portion is formed by the test pin on a surface of the first metal pad in which the first bonding pad is not disposed.

8. The method of claim 7 , wherein the first polymer layer fills the uneven portion.

9. The method of claim 6 , wherein the first metal pad comprises a plurality of first metal pads,

the first bonding pad is disposed on all of the plurality of first metal pads, and

an uneven portion is formed by the test pin on a surface of at least one of the plurality of first metal pads.

10. The method of claim 9 , wherein the first bonding pad fills the uneven portion.

11. A manufacturing method of a semiconductor package, the method comprising:

preparing a first wafer comprising a first metal wiring layer on a first substrate, a first metal pad on the first metal wiring layer, and a first insulating layer on the first metal pad, the first wafer comprising a plurality of individual dies;

patterning the first insulating layer to expose a top surface of the first metal pad;

performing a test by contacting the exposed first metal pad with a test pin of a test device;

forming a mask pattern on the first insulating layer and the first metal pad;

forming a first bonding pad on a surface of the first metal pad on which the mask pattern is not formed;

removing the mask pattern;

forming a first polymer layer covering all of the first insulating layer, the first metal pad, and the first bonding pad;

exposing the first bonding pad by polishing the first polymer layer;

separating a first wafer into individual dies by cutting the first wafer; and

bonding the dies that have been separated to a second wafer,

wherein each die comprises at least one first bonding pad.

12. The method of claim 11 , wherein

the second wafer comprises at least one second bonding pad and a second polymer layer,

the at least one first bonding pad of the die is bonded to the at least one second bonding pad of the second wafer, and

the first polymer layer of the die is bonded to the second polymer layer of the second wafer.

13. The method of claim 11 , wherein the first polymer layer is formed to surround all side surfaces of the first bonding pad.

14. The method of claim 11 , wherein an area of the first metal pad is formed to be greater than an area of the first bonding pad.

15. The method of claim 11 , wherein the performing of the test forms an uneven portion on a surface of the first metal pad that contacts the test pin.

16. The method of claim 15 , wherein the first bonding pad is not formed on the first metal pad on which the uneven portion is formed.

17. The method of claim 16 , wherein the first polymer layer is formed to fill the uneven portion of the first metal pad.

18. The method of claim 11 , wherein the performing of the test determines that a die that has passed the test is good, and determines that a die that has not passed the test is defective.

19. The method of claim 18 , wherein at least one die is determined as good and is bonded to the second wafer, after the first wafer is separated into individual dies.

20. The method of claim 19 , further comprising:

cutting the second wafer; and

separating the cut second wafer into individual semiconductor packages, after the at least one die determined as good has been bonded to the second wafer.