High power density server with hybrid thermal management
An information technology (IT) enclosure may have a hybrid architecture. Such an enclosure may include an immersion tank that holds a single-phase coolant fluid. One or more servers may be immersed in the tank. The server chassis may have electronics that are thermally coupled to a two-phase fluid via a thermosiphon loop. The server chassis includes a condensing unit forming the thermosiphon loop and the condensing unit is submerged in the single phase fluid.
1. An internet technology (IT) enclosure, comprising:
a tank that holds a single-phase fluid;
one or more server chassis immersed in the single-phase fluid within the tank; and
one or more condensers, each comprising
a thermosiphon loop that receives and returns a two-phase fluid from and to electronics which are housed by each of the one or more server chassis, and
a liquid cooling loop that is thermally coupled to the thermosiphon loop to condense the two-phase fluid from vapor to liquid.
2. The IT enclosure of claim 1 , wherein each of the one or more condensers are immersed in and thermally coupled to the single-phase fluid within the tank.
3. The IT enclosure of claim 1 , wherein each of the one or more condensers includes paths in which the single-phase fluid flows through such that the single-phase fluid is in direct contact with conduit that holds a section of the thermosiphon loop.
4. The IT enclosure of claim 1 , wherein each of the one or more condensers has one or more fins that are immersed in the single-phase fluid and thermally coupled to the thermosiphon loop.
5. The IT enclosure of claim 1 , wherein the tank includes an acceleration channel that directs the single-phase fluid over or through each of the one or more condensers at a higher flow rate than the single-phase fluid outside of the acceleration channel.
6. The IT enclosure of claim 5 , wherein the acceleration channel is formed by one or more walls within the tank, and a first pump that is fluidly connected to the tank to pump the single-phase fluid from the acceleration channel resulting in the higher flow rate within the acceleration channel.
7. The IT enclosure of claim 6 , further comprising a control server that is configured to control the first pump, based on a temperature of the electronics.
8. The IT enclosure of claim 7 , wherein the control server is further configured to control a second pump that is fluidly connected to the liquid cooling loop to control a liquid flow rate within the liquid cooling loop, or a third pump that is fluidly connected to the single-phase fluid in the tank outside of the acceleration channel, based on the temperature of the electronics.
9. The IT enclosure of claim 1 , wherein each of the one or more server chassis includes a printed circuit board that holds the electronics, and a cooling plate that is thermally coupled to the electronics, wherein the cooling plate includes a two-phase fluid line that circulates the two-phase fluid in the thermosiphon loop in vapor form, and receives the two-phase fluid from the thermosiphon loop in liquid form.
10. The IT enclosure of claim 9 , wherein at least one of the one or more server chassis further includes a second cooling plate that is fluidly connected to the liquid cooling loop of the condenser and does not contain the two-phase fluid.
11. The IT enclosure of claim 1 , wherein a first heat exchanger is fluidly coupled to the liquid cooling loop and a second heat exchanger is fluidly coupled to the single-phase fluid held in the tank, and a common cooling system supplies an external fluid to the first heat exchanger and the second heat exchanger.
12. A data center comprising:
a plurality of information technology (IT) enclosures, one or more of the IT enclosures including:
a tank that holds a single-phase fluid;
one or more server chassis immersed in the single-phase fluid within the tank; and
one or more condensers, each comprising
a thermosiphon loop that receives and returns a two-phase fluid from and to electronics which are housed by each of the one or more server chassis, and
a liquid cooling loop that is thermally coupled to the thermosiphon loop to condense the two-phase fluid from vapor to liquid.
13. The data center of claim 12 , wherein each of the one or more condensers are immersed in and thermally coupled to the single-phase fluid within the tank.
14. The data center of claim 12 , wherein each of the one or more condensers includes paths in which the single-phase fluid flows through such that the single-phase fluid is in direct contact with conduit that holds a section of the thermosiphon loop.
15. The data center of claim 12 , wherein each of the one or more condensers has one or more fins that are immersed in the single-phase fluid and thermally coupled to the thermosiphon loop.
16. The data center of claim 12 , wherein the tank includes an acceleration channel that directs the single-phase fluid over or through each of the one or more condensers at a higher flow rate than the single-phase fluid outside of the acceleration channel.
17. The data center of claim 16 , wherein the acceleration channel informed by one or more walls within the tank, and a first pump that is fluidly connected to the tank to pump the single-phase fluid from the acceleration channel resulting in the higher flow rate within the acceleration channel.
18. The data center of claim 17 , wherein the one or more of the IT enclosures further comprises a control server that is configured to control the first pump, based on a temperature of the electronics.
19. The data center of claim 18 , wherein the control server is further configured to control a second pump that is fluidly connected to the liquid cooling loop to control a liquid flow rate within the liquid cooling loop, or a third pump that is fluidly connected to the single-phase fluid in the tank outside of the acceleration channel, based on the temperature of the electronics.
20. The data center of claim 12 , wherein each of the one or more server chassis includes a printed circuit board that holds the electronics, and a cooling plate that is thermally coupled to the electronics, wherein the cooling plate includes a two-phase fluid line that circulates the two-phase fluid in the thermosiphon loop in vapor form, and receives the two-phase fluid from the thermosiphon loop in liquid form.