IP Library Granted Patent US 12,464,689
Granted Patent B2
US 12,464,689 · App. 18/081,770 · Granted Nov 4, 2025

Thermal management system for a power converter

Inventors: Sanjay Vijayaraghavan (Bangalore, IN); Libing Wang (Niskayuna, NY); Han Xiong (Niskayuna, NY); Kum Kang Huh (Niskayuna, NY); Di Pan (Schenectady, NY); Mark Edward Dame (Niskayuna, NY); Rajib Datta (Niskayuna, NY); Alankrita Singh (Bhilai, IN)
Assignee: General Electric Company
H05K7/20927H05K5/0217
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Quick Facts
Patent No.
US 12,464,689
App. No.
18/081,770
Granted
Nov 4, 2025
Kind
B2
Abstract

A power converter assembly includes a housing, a cold plate in the housing, and a set of power converter components on the cold plate. The cold plate is configured to receive a coolant. A first medium in the housing surrounds the cold plate and components. An expandable heat transfer structure is attached to one of the cold plate and the housing.

Claims (25)

1 . A power converter assembly, comprising:

a housing;

a cold plate in the housing, wherein the cold plate is configured to receive a coolant;

a set of power converter components on the cold plate;

a first medium in the housing surrounding the cold plate and components; and

an expandable heat transfer structure attached to one of the cold plate and the housing.

2 . The power converter assembly of claim 1 , wherein the expandable heat transfer structure is attached to the cold plate.

3 . The power converter assembly of claim 1 , wherein the first medium is a liquid or pressurized gas that provides a dielectric resistance.

4 . The power converter assembly of claim 1 , wherein the first medium is an oil.

5 . The power converter assembly of claim 1 , wherein the expandable heat transfer structure includes a conductive material that is configured to transfer heat to the one of the cold plate and the housing.

6 . The power converter assembly of claim 1 , wherein the expandable heat transfer structure has an expandable surface area.

7 . The power converter assembly of claim 1 , wherein the expandable heat transfer structure is additively manufactured.

8 . The power converter assembly of claim 1 , wherein the expandable heat transfer structure is filled with a gas.

9 . The power converter assembly of claim 8 , wherein the first medium is a liquid that provides dielectric resistance.

10 . The power converter assembly of claim 1 , wherein at least some of the components are covered with a solid insulating material.

11 . The power converter assembly of claim 1 , wherein the cold plate is a first cold plate and the power converter assembly further comprising a second cold plate.

12 . The power converter assembly of claim 11 , wherein the first cold plate and the second cold plate are configured such that the first cold plate is upstream with respect to the second cold plate.

13 . The power converter assembly of claim 12 , wherein the components include a first set of components and a second set of components, wherein the first set of components are on the first cold plate and the second set of components are on the second cold plate.

14 . The power converter assembly of claim 13 , wherein the first set of components are configured to generate more heat than the second set of components.

15 . The power converter assembly of claim 13 , wherein the first set of components includes high-power switching modules.

16 . The power converter assembly of claim 15 , wherein the high-power switching modules include at least one of a MOSFET, an IGBT, and a gate driver.

17 . The power converter assembly of claim 13 , wherein the second set of components includes auxiliary components.

18 . The power converter assembly of claim 17 , wherein the auxiliary components include at least one of a capacitor, an inductor, a resistor, and a bus bar, a capacitor, an inductor, a resistor, a bus bar, a control board, a gate driver board, and an interface board.

19 . The power converter assembly of claim 1 , wherein the first medium is sealed in the housing.

20 . The power converter assembly of claim 1 , wherein the expandable heat transfer structure includes at least one of a bellows structure, a gusset structure, and a gas spring structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2022
From: VIJAYARAGHAVAN, SANJAY; WANG, LIBING; XIONG, HAN; HUH, KUM KANG; PAN, DI; DAME, MARK EDWARD; DATTA, RAJIB; SINGH, ALANKRITA
To: GENERAL ELECTRIC COMPANY
Reel/Frame 062099/0209 →
Priority Claims (1)
IN 202211030257 · May 26, 2022 · national
Continuity (1)
Related Publication 20230389241A1 · Nov 30, 2023
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