Power electronics cooling assemblies and methods for making the same
A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.
1. A method for forming a power electronics module, the method comprising:
positioning an electrically-insulating layer on a surface of a heat sink;
positioning a conductive substrate on a surface of the electrically-insulating layer opposite the heat sink;
positioning a power electronics device on a surface of the conductive substrate opposite the electrically-insulating layer;
positioning a printed circuit board layer over the electrically-insulating layer, at least partially embedding the electrically-insulating layer, the conductive substrate, and the power electronics device; and
positioning a driver circuit component on a surface of the printed circuit board layer opposite the heat sink.
2. The method of claim 1 , wherein the power electronics device is a first power electronics device, the method further comprising electrically coupling the first power electronics device to a second power electronics device with a conduit extending between the first power electronics device and the second power electronics device, wherein the first power electronics device and the second power electronics device are positioned between the conduit and the electrically-insulating layer.
3. The method of claim 1 , further comprising coupling a clamp to the printed circuit board layer, wherein the clamp extends around the heat sink.
4. The method of claim 3 wherein the clamp at least partially encapsulates the heat sink.
5. The method of claim 1 , wherein positioning the printed circuit board layer over the electrically-insulating layer comprises positioning printed circuit board material within a through hole extending through the electrically-insulating layer.
6. The method of claim 1 , wherein the driver circuit component is a first driver circuit component, and wherein the method further comprises positioning a second driver circuit component on the surface of the printed circuit board layer and electrically coupling the first driver circuit component to the second driver circuit component.