Imaging unit having a stacked structure and electronic apparatus including the imaging unit
Provided is a solid-state imaging unit that includes a stacked structure including a sensor substrate and a circuit board. The sensor board has an effective pixel region where an imaging device is disposed. The imaging device includes a plurality of pixels and is configured to receive external light in each of the pixels to generate a pixel signal. The circuit board includes a chip including a first portion and a second portion that are integrated with each other. The first portion includes a signal processing circuit that performs signal processing of the pixel signal. The second portion is disposed at a position different from a position of the first portion in an in-plane direction. Here, both the first portion and the second portion are disposed to overlap the effective pixel region in a stacking direction of the sensor board and the circuit board.
1. An imaging unit, comprising
a stacked structure that includes:
a sensor board that includes having an effective pixel region, wherein
the effective pixel region includes an imaging device,
the imaging device includes a plurality of pixels, and
the imaging device is configured to receive external light in each pixel of the plurality of pixels to generate a pixel signal; and
a circuit board that includes a chip, wherein
the chip includes a first portion and a second portion,
the first portion is integrated with the second portion,
the first portion includes a signal processing circuit,
the signal processing circuit includes a first semiconductor device configured to execute signal processing of the pixel signal,
the second portion is at a position different from a position of the first portion in an in-plane direction on the circuit board,
the second portion includes a dummy circuit including a second semiconductor device, and
both the first portion and the second portion overlap the effective pixel region in a stacking direction of the sensor board and the circuit board.
2. The imaging unit according to claim 1 , wherein an outer edge of the chip one of:
overlaps an outer edge of the effective pixel region in the stacking direction of the sensor board and the circuit board, or
is on an outer side with respect to the outer edge of the effective pixel region in the stacking direction of the sensor board and the circuit board.
3. The imaging unit according to claim 1 , further comprising a wiring line configured to electrically couple the imaging device to the signal processing circuit.
4. The imaging unit according to claim 3 , wherein
the wiring line includes a first wiring-line portion and a second wiring-line portion,
the sensor board includes the first wiring-line portion,
the first wiring-line portion is exposed on a surface of the sensor board,
the circuit board includes the second wiring-line portion,
the second wiring-line portion is exposed on a surface of the circuit board, and
the first wiring-line portion is bonded to the second wiring-line portion.
5. The imaging unit according to claim 1 , wherein
the circuit board further includes:
a single semiconductor substrate; and
a circuit formation layer on the single semiconductor substrate, and
the circuit formation layer includes the signal processing circuit and the dummy circuit.
6. The imaging unit according to claim 1 , wherein
the stacked structure further includes a third board on an opposite side of the circuit board, and
the circuit board is between the third board and the sensor board.
7. The imaging unit according to claim 1 , wherein the signal processing circuit further includes at least one of a logic circuit, a memory circuit, a power circuit, an image signal compression circuit, a clock circuit, or an optical communication conversion circuit.
8. An electronic apparatus, comprising:
an imaging unit, wherein the imaging unit includes:
a stacked structure that includes:
a sensor board that includes having an effective pixel region, wherein
the effective pixel region includes an imaging device,
the imaging device includes a plurality of pixels, and
the imaging device is configured to receive external light in each pixel of the plurality of pixels to generate a pixel signal; and
a circuit board that includes a first portion and a second portion, wherein
the first portion is integrated with the second portion,
the first portion includes a signal processing circuit,
the signal processing circuit includes a first semiconductor device configured to execute signal processing of the pixel signal,
the second portion is at a position different from a position of the first portion in an in-plane direction on the circuit board,
the second portion includes a dummy circuit including a second semiconductor device, and
both the first portion and the second portion overlap the effective pixel region in a stacking direction of the sensor board and the circuit board.