IP Library › Granted Patent US 11,670,639
Granted Patent B2
US 11,670,639 · App. 16/627,366 · Granted Jun 6, 2023

Flexible display substrate and preparation method thereof

Inventor: Linshuang Li (Shenzhen, CN)
Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology cO., lTD.
H01L27/1218H01L27/1262H01L51/0097H01L25/167H01L27/3244
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Quick Facts
Patent No.
US 11,670,639
App. No.
16/627,366
Granted
Jun 6, 2023
Kind
B2
Abstract

A flexible display device substrate and a preparation method thereof are provided. The flexible display device substrate includes a first flexible substrate, a toughening layer, a second flexible substrate, and an interweaved structure layer. The second flexible substrate is disposed on the first flexible substrate. The interweaving structure layer is disposed between the first flexible substrate and the second flexible substrate, wherein the interweaving structure layer is formed by a part of the first flexible substrate and a part of the second flexible substrate penetrating and interweaving with each other. The toughening layer is disposed at intervals between the first flexible substrate and the second flexible substrate, and the toughening layer and the interweaved structure layer are disposed alternately.

Claims (10)

1. A flexible display device substrate comprising:

first flexible substrate;

a second flexible substrate disposed on the first flexible substrate; and

an interweaved structure layer disposed between the first flexible substrate and the second flexible substrate, wherein the interweaved structure layer is formed by a part of the first flexible substrate and a part of the second flexible substrate weaving and penetrating with each other,

a toughening layer, disposed at intervals between the first flexible substrate and the second flexible substrate, wherein the toughening layer is a layered structure,

wherein a portion of the toughening layer is embedded/sink into the first flexible substrate, the first flexible substrate surrounds a lower half of the toughening layer, and the second flexible substrate covers an upper half of the toughening layer,

a bonding strength between the first flexible substrate and the second flexible substrate in the interweaved structure layer is greater than 8.74N/cm, and

an optical transmissions of the first flexible substrate and the second flexible substrate are greater than 90%, a yellow indexes are less than 2, and a hazes are less than 1.

2. The flexible display device substrate as claimed in claim 1 , wherein the toughening layer and the interweaved structure layer are disposed alternately.

3. The flexible display device substrate as claimed in claim 1 , wherein a thickness of the second flexible substrate is not lower than a thickness of the first flexible substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2020
From: LI, LINSHUANG
To: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Reel/Frame 051996/0613 →
Priority Claims (1)
CN 201911051669.2 · Oct 31, 2019 · national
Continuity (1)
Related Publication 20210358966A1 · Nov 18, 2021