Semiconductor device package and method of manufacturing the same
A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
1. A semiconductor device package, comprising:
a conductive layer including a surface;
a first antenna disposed over the surface of the conductive layer and configured for operating in a first frequency;
a second antenna disposed over the first antenna and configured for operating in a second frequency different from the first frequency; and
a third antenna disposed over the second antenna.
2. The semiconductor device package of claim 1 , wherein the third antenna is configured for operating in the second frequency.
3. The semiconductor device package of claim 1 , further comprising a first conductive path configured to pass through the first antenna and to be electrically connected with the second antenna.
4. The semiconductor device package of claim 3 , wherein the first conductive path is configured to pass through the conductive layer.
5. The semiconductor device package of claim 3 , wherein the first conductive path is physically disconnected with the first antenna.
6. The semiconductor device package of claim 3 , further comprising a second conductive path configured to pass through the first antenna and to be electrically connected with the second antenna.
7. The semiconductor device package of claim 6 , wherein the second conductive path is physically disconnected with the first antenna.
8. The semiconductor device package of claim 6 , wherein the second conductive path is configured to pass through the conductive layer.
9. The semiconductor device package of claim 1 , wherein the first frequency is less than the second frequency.
10. The semiconductor device package of claim 9 , wherein the first antenna includes an array of antenna elements.
11. The semiconductor device package of claim 10 , wherein the second antenna includes an array of antenna elements.
12. The semiconductor device package of claim 1 , further comprising a dielectric layer disposed over the surface of the conductive layer and configured to separate the first antenna from the second antenna.
13. The semiconductor device package of claim 12 , wherein the conductive layer includes a grounding layer.