Multilayer capacitor

1. A multilayer capacitor comprising:

a capacitor body including first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and including alternately stacked first internal electrodes and second internal electrodes having dielectric layers interposed therebetween and each having one end thereof exposed through a respective one of the third and fourth surfaces;

first and second conductive layers respectively including first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body;

first and second reinforcing layers disposed on the first and second band portions without extending to the first and second connection portions, respectively; and

first and second layers respectively disposed on the first and second reinforcing layers such that an interface is defined therebetween,

wherein the first and second layers respectively include first and second conductive resin layers on the first and second conductive layers, respectively.

2. The multilayer capacitor of claim 1 , wherein the first and second reinforcing layers are spaced apart from the first and second internal electrodes exposed through the first and second connection portions of the first and second conductive layers.

3. The multilayer capacitor of claim 1 , wherein a length of the first and second reinforcing layers in the length direction is longer than a length of the first and second band portions in the length direction.

4. The multilayer capacitor of claim 1 , wherein the first conductive resin layer is disposed on the first connection portion and the first reinforcing layer, and

the second conductive resin layer is disposed on the second connection portion and the second reinforcing layer.

5. The multilayer capacitor of claim 4 , further comprising first and second plating layers disposed on the first and second conductive resin layers, respectively.

6. The multilayer capacitor of claim 5 , wherein the first and second plating layers comprise first and second nickel (Ni) plating layers, and first and second tin (Sn) plating layers disposed on the first and second nickel plating layers, respectively.

7. The multilayer capacitor of claim 1 , wherein the first and second reinforcing layers each include a carbon material and an impact absorbing binder.

8. The multilayer capacitor of claim 7 , wherein the carbon material of the first and second reinforcing layers comprises one or more of graphene, carbon nanotubes, and carbon black.

9. The multilayer capacitor of claim 7 , wherein the impact-absorbing binder of the first and second reinforcing layers comprises an epoxy-based or an acrylic-based binder.

10. The multilayer capacitor of claim 1 , wherein each of the first and second reinforcing layers extends from the respective first or second band portions onto surfaces of the capacitor body.

11. The multilayer capacitor of claim 1 , wherein the first reinforcing layer is spaced apart from the second reinforcing layer.

12. A multilayer capacitor comprising:

a capacitor body including first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and including alternately stacked first internal electrodes and second internal electrodes having dielectric layers interposed therebetween and each having one end thereof exposed through a respective one of the third and fourth surfaces;

first and second conductive layers respectively including first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body;

first and second reinforcing layers disposed on the first and second band portions, respectively; and

first and second layers respectively disposed on the first and second reinforcing layers such that an interface is defined therebetween,

wherein the first and second layers respectively include first and second conductive resin layers on the first and second conductive layers, respectively,

wherein the first and second reinforcing layers are further respectively disposed on the first and second connection portions, and

wherein end portions of the first and second conductive resin layers reach respective end portions of the first and second reinforcing layers in the length direction.

13. The multilayer capacitor of claim 12 , wherein the first and second conductive resin layers are disposed on the first and second first reinforcing layers, respectively

wherein the first reinforcing layer is disposed between the first conductive layer and the first conductive resin layer, and

the second reinforcing layer is disposed between the second conductive layer and the second conductive resin layer.

14. The multilayer capacitor of claim 12 , further comprising first and second plating layers disposed on the first and second conductive resin layers, respectively,

wherein the first reinforcing layer is disposed between the first conductive layer and the first conductive resin layer, and

the second reinforcing layer is disposed between the second conductive layer and the second conductive resin layer.

15. The multilayer capacitor of claim 14 , wherein the first and second plating layers comprise first and second nickel (Ni) plating layers disposed on the first and second conductive resin layers, respectively, and first and second tin (Sn) plating layers disposed on the first and second nickel plating layers, respectively.

16. The multilayer capacitor of claim 12 , wherein the first and second reinforcing layers each include a carbon material and an impact absorbing binder.

17. The multilayer capacitor of claim 16 , wherein the carbon material of the first and second reinforcing layers comprises one or more of graphene, carbon nanotubes, and carbon black.

18. The multilayer capacitor of claim 16 , wherein the impact-absorbing binder of the first and second reinforcing layers comprises an epoxy-based or an acrylic-based binder.

19. The multilayer capacitor of claim 12 , wherein the first reinforcing layer is spaced apart from the second reinforcing layer.

20. The multilayer capacitor of claim 12 , wherein the first and second reinforcing layers are spaced apart from surfaces of the capacitor body.