IP Library › Granted Patent US 11,680,139
Granted Patent B2
US 11,680,139 · App. 17/621,906 · Granted Jun 20, 2023

Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Inventors: Yune Kumazawa (Tokyo, JP); Takuya Suzuki (Tokyo, JP); Seiji Shika (Tokyo, JP); Shunsuke Katagiri (Tokyo, JP)
Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
C08G73/1025C08K5/3415H05K1/0298H05K1/0373
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Quick Facts
Patent No.
US 11,680,139
App. No.
17/621,906
Granted
Jun 20, 2023
Kind
B2
Abstract

A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): wherein R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.

Claims (10)

1. A multilayer printed wiring board comprising:

an insulating layer; and

a conductor layer formed on one surface or both surfaces of the insulating layer,

wherein the insulating layer comprises a resin composition comprising a bismaleimide compound (A) comprising a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain;

at least one resin or compound (B) selected from the group consisting of a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having two or more ethylenically unsaturated groups in a molecule; and

a photo initiator (C):

wherein R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.

2. The multilayer printed wiring board of claim 1 , wherein the photo initiator (C) comprises a compound represented by the following formula (2):

wherein each R 4 independently represents a substituent represented by the following formula (3) or a phenyl group; and

wherein -* represents a bonding hand, and each R 5 independently represents a hydrogen atom or a methyl group.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2022
From: KUMAZAWA, YUNE; SUZUKI, TAKUYA; SHIKA, SEIJI; KATAGIRI, SHUNSUKE
To: MITSUBISHI GAS CHEMICAL COMPANY, INC.
Reel/Frame 058940/0916 →
Priority Claims (1)
JP JP2019-122268 · Jun 28, 2019 · national
Continuity (1)
Related Publication 20220204694A1 · Jun 30, 2022
Cited By (1)
US 12,492,327