Method for producing silicone-based adhesive

1. A method for producing a silicone-based adhesive, the method comprising:

(1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I), said silicone composition (I) comprising (a) a silicone resin comprising a siloxane unit represented by the formula R 3 SiO 1/2 where each R represents the same or different monovalent hydrocarbon group with 1 to 12 carbon atoms, and a siloxane unit represented by the formula SiO 4/2 ; and

(2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II), said silicone composition (II) comprising:

(c′) an organopolysiloxane having at least two alkenyl groups in a molecule;

(d′) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and

(e′) a hydrosilylation reaction catalyst;

wherein the silicone composition (II) either does not contain the silicone resin or if contained, its content amount is less than that in the silicone composition (I), and

wherein step (2) further comprises:

(i) curing the silicone composition (II) after transferring a part of the silicone resin from the silicone layer (I) into the layer of the silicone composition (II);

(ii) curing the layer of the silicone composition (II) while transferring a part of the silicone resin from the silicone layer (I) to the silicone composition (II);

(iii) after curing the silicone composition (II), transferring a part of the silicone resin from the silicone layer (I) to the cured product of the silicone composition (II); or

any of the combinations of (i) to (iii) described above.

2. The method according to claim 1 , wherein the silicone composition (I) is at least one type selected from a group consisting of (i) to (iii) below:

(i) a silicone composition comprising: (a) the silicone resin; and (b) a diorganopolysiloxane;

(ii) a silicone composition comprising: component (a) above; component (b) above; and a partially cross-linked material of components (a) and (b) above;

(iii) a silicone composition comprising: component (a) above; (c) an organopolysiloxane having at least two alkenyl groups in a molecule; (d) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (e) a hydrosilylation reaction catalyst.

3. The method according to claim 1 , wherein the silicone composition (I) contains at least 50 mass % of (a) the silicone resin, and wherein the silicone composition (II) either does not contain component (a) above, or if contained, a content amount thereof is lower than that in the silicone composition (I).

4. The method according to claim 1 , wherein a shear storage modulus at 25° C. of a silicone formed by curing or drying the silicone composition (I) is larger than a shear storage modulus at 25° C. of a silicone cured product obtained by curing only the silicone composition (II).

5. The method according to claim 1 , further comprising:

(3) adhering a substrate to a surface of the silicone-based adhesive.

6. The method according to claim 5 , wherein the substrate is a peelable substrate.

7. The method according to claim 2 , wherein the silicone composition (I) contains at least 50 mass % of component (a) above, and wherein the silicone composition (II) either does not contain component (a) above, or if contained, a content amount thereof is lower than that in the silicone composition (I).

8. The method according to claim 1 , wherein the silicone layer (I) has a thickness of from 20 to 200 μm.

9. The method according to claim 1 , wherein the silicone layer (I) has a thickness of from 20 to 100 μm.

10. The method according to claim 1 , wherein the shear storage modulus at 25° C. of the silicon formed by curing or drying the silicone composition (I) is 0.7 MPa or higher and the shear storage modulus at 25° C. of the silicon cured product obtained by curing only the silicone composition (II) is less than 0.7 MPa.

11. The method according to claim 1 , wherein the shear storage modulus at 25° C. of the silicon formed by curing or drying the silicone composition (I) is 1 MPa or higher and the shear storage modulus at 25° C. of the silicon cured product obtained by curing only the silicone composition (II) is less than 0.3 MPa.

12. The method according to claim 1 , wherein the glass transition point (Tg) of the silicone formed by curing or drying the silicone composition (I) is higher than the glass transition point (Tg) of the silicon cured product obtained by curing only the silicone composition (II).

13. The method according to claim 6 , wherein the substrate is further defined as a film comprising polyethylene, polypropylene, polystyrene, polyvinyl chloride, polycarbonate, polyethylene terephthalate (PET), or nylon.

14. The method according to claim 6 , wherein the substrate is further defined as a film surface-treated with a fluorosilicone or a fluorine-based resin.

15. The method according to claim 1 , further comprising adhering a first peelable substrate to a first surface of the silicone-based adhesive and a second peelable substrate to a second surface of the silicone-based adhesive.

16. The method according to claim 6 , wherein the peelable substrate does not zip upon removal from the silicone-based adhesive after storage for 2 days at 70° C.