Devices for fabrication of shielded modules
Devices for fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.
1. A module packaging system comprising:
an assembly system including a carrier assembly that includes a plate having a first side and a second side, and defining a plurality of openings, such that each opening extends through the plate between the first side and the second side, the plate including a tape removal feature, the carrier assembly further including a double-sided tape implemented on the first side of the plate, the double-sided tape defining a plurality of openings arranged to substantially match the openings of the plate, the double-sided tape being dimensioned such that the tape removal feature of the plate facilitates removal of the double-sided tape from the first side of the plate;
a handling system including a pick-and-place apparatus for placing a package over each opening of the plate such that the double-sided tape provides an adhesive engagement between a perimeter portion of an underside of the package and a perimeter portion about the opening of the double-sided tape; and
a conformal shield application system including a deposition apparatus for performing a deposition operation from the first side of the plate on the packages positioned over the respective openings of the plate.
2. The system of claim 1 wherein the underside of the package being attached to the perimeter portion about the opening of the double-sided tape results in the underside of each package being protected from exposure during the deposition operation.
3. The system of claim 1 wherein the underside of the package being attached to the perimeter portion about the opening of the double-sided tape results in upper surface and side walls of each package being open to exposure during the deposition operation.
4. The system of claim 1 wherein each package includes a radio-frequency circuit.
5. The system of claim 1 wherein the deposition apparatus of the conformal shield application system includes a sputter deposition apparatus for providing a sputter deposition operation.
6. The system of claim 1 wherein each opening of the double-sided tape is dimensioned to receive and accommodate an underside feature of the respective package when the perimeter portion of the underside of the package is adhesively engaged with the perimeter portion about the opening of the double-sided tape.
7. The system of claim 6 wherein the underside feature of the package includes a ball grid array having a plurality of solder balls.
8. The system of claim 7 wherein the plate has a thickness selected such that the solder balls of the package are within the opening of the plate when the perimeter portion of the underside of the package is adhesively engaged with the perimeter portion about the opening of the double-sided tape.
9. The system of claim 7 wherein the plate has a thickness selected such that a portion of each solder ball of the package extends beyond the second side of the plate when the perimeter portion of the underside of the package is adhesively engaged with the perimeter portion about the opening of the double-sided tape.
10. The system of claim 1 wherein each package is a singulated un-shielded package.
11. The system of claim 1 wherein the plate has a rectangular shape.
12. The system of claim 1 wherein the plate has a wafer-like shape.
13. The system of claim 12 wherein the deposition apparatus is configured to process wafers, such that the deposition apparatus is capable of process the carrier assembly having the plate with the wafer-like shape.
14. The system of claim 1 wherein the double-sided tape includes a polyimide film and adhesive layers provided on both sides of the polyimide film, each adhesive layer formed from a high-temperature adhesive material.