Power electronics module with improved space utilization and thermal management characteristics
A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.
1. A power electronics module for an industrial or vehicle battery charger system, comprising:
a chassis housing comprising a heatsink surface and a plurality of sidewalls;
a main power section printed circuit board disposed adjacent to the heatsink surface of the chassis housing;
a low voltage, low power printed circuit board disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing; and
an alternating current input filter portion printed circuit board comprising electromagnetics disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing;
wherein the main power section printed circuit board and the alternating current input filter portion printed circuit board comprise separate printed circuit boards.
2. The power electronics module of claim 1 , further comprising a cooling fan disposed at least partially within the chassis housing adjacent to the main power section printed circuit board.
3. The power electronics module of claim 1 , wherein the main power section printed circuit board comprises an alternating current to direct current converter and a direct current to direct current boost.
4. The power electronics module of claim 1 , wherein the low voltage, low power printed circuit board comprises a processor and a connector.
5. The power electronics module of claim 1 , wherein the alternating current input filter portion printed circuit board is separated from the low voltage, low power printed circuit board within the chassis housing such that the low voltage, low power printed circuit board is isolated from electromagnetic interference from the electromagnetics of the alternating current input filter portion printed circuit board.
6. The power electronics module of claim 1 , further comprising:
an electromagnetic component disposed adjacent to the heatsink surface of the chassis housing; and
a thermally conductive plastic enclosure disposed partially or wholly about the electromagnetic component;
wherein a bottom surface of the thermally conductive plastic enclosure comprises a plurality of protruding fin or pin structures that are adapted to protrude through a port manufactured into or through the heatsink surface of the chassis housing and into a cooling fluid channel formed within or disposed adjacent to the heatsink surface of the chassis housing.
7. The power electronics module of claim 6 , wherein the thermally conductive plastic enclosure is sealingly coupled to an interior portion of the heatsink surface around a bottom edge of the thermally conductive plastic enclosure.
8. The power electronics module of claim 1 , wherein the heatsink surface comprises:
an interior heatsink surface and an exterior heatsink surface; and
a plurality of wall structures disposed between the interior heatsink surface and the exterior heatsink surface defining a sealed cooling fluid channel between an inlet port for receiving a cooling fluid into the cooling fluid channel and an outlet port for delivering the cooling fluid from the cooling fluid channel.
9. The power electronics module of claim 8 , wherein the heatsink surface further comprises a plurality of fin structures formed within the cooling fluid channel between the interior heatsink surface and the exterior heatsink surface adapted to interrupt a flow of the cooling fluid within the cooling fluid channel between the input port and the output port.
10. The power electronics module of claim 9 , wherein the plurality of fin structures formed within the cooling fluid channel are collocated with one or more of the main power section printed circuit board disposed within the chassis housing and an electromagnetic component disposed within the chassis housing.
11. The power electronics chassis housing of claim 8 , wherein the heatsink surface further comprises a plurality of pin structures formed within the cooling fluid channel between the interior heatsink surface and the exterior heatsink surface adapted to interrupt a flow of the cooling fluid within the cooling fluid channel between the input port and the output port.
12. The power electronics module of claim 11 , wherein the plurality of fin structures formed within the cooling fluid channel are collocated with one or more of the main power section printed circuit board disposed within the chassis housing and an electromagnetic component disposed within the chassis housing.
13. A power electronics module for an industrial or vehicle battery charger system, comprising:
a chassis housing comprising a heatsink surface;
an electromagnetic component disposed within the chassis housing adjacent to the heatsink surface of the chassis housing; and
a thermally conductive plastic enclosure disposed within the chassis housing partially or wholly about the electromagnetic component;
wherein a bottom surface of the thermally conductive plastic enclosure comprises a plurality of protruding fin or pin structures that are adapted to protrude through a port manufactured into or through the heatsink surface of the chassis housing and into a cooling fluid channel formed within or disposed adjacent to the heatsink surface of the chassis housing.
14. The power electronics module of claim 13 , wherein the thermally conductive plastic enclosure is sealingly coupled to an interior portion of the heatsink surface around a bottom edge of the thermally conductive plastic enclosure.
15. The power electronics module of claim 14 , wherein the thermally conductive plastic enclosure is sealingly coupled to the interior portion of the heatsink surface around the bottom edge of the thermally conductive plastic enclosure using a sealant.
16. A power electronics module chassis housing for an industrial or vehicle battery charger system, comprising:
a heatsink surface comprising an interior heatsink surface and an exterior heatsink surface;
a plurality of wall structures disposed between the interior heatsink surface and the exterior heatsink surface defining a sealed cooling fluid channel between an inlet port for receiving a cooling fluid into the cooling fluid channel and an outlet port for delivering the cooling fluid from the cooling fluid channel; and
a plurality of pin structures formed within the cooling fluid channel between the interior heatsink surface and the exterior heatsink surface adapted to interrupt a flow of the cooling fluid within the cooling fluid channel between the input port and the output port.
17. The power electronics module chassis housing of claim 16 , further comprising a plurality of fin structures formed within the cooling fluid channel between the interior heatsink surface and the exterior heatsink surface adapted to interrupt a flow of the cooling fluid within the cooling fluid channel between the input port and the output port.
18. The power electronics module chassis housing of claim 17 , wherein the plurality of fin structures formed within the cooling fluid channel are collocated with a hot high voltage, high power printed circuit board or hot electromagnetic component disposed within the power electronics chassis.
19. The power electronics module chassis housing of claim 16 , wherein the plurality of pin structures formed within the cooling fluid channel are collocated with a hot high voltage, high power printed circuit board or hot electromagnetic component disposed within the power electronics chassis.