Multilayer ceramic capacitor having external electrodes provided with fluorine compound
A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and a fluorine compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, fluorine compound being released at a temperature of 380 degrees C. or more.
1. A multilayer ceramic capacitor comprising:
a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, respective one ends of the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face;
a first external electrode provided on the first end face;
a second external electrode provided on the second end face; and
a fluorine compound that is adhered to surfaces of the first external electrode and the second external electrode, the fluorine compound being released at a temperature of 380 degrees C. or more, but not released at a temperature less than 380 degrees C.,
wherein a thickness of the fluorine compound on the surfaces of the first external electrode and the second external electrode is 1 nm to 80 nm,
wherein solely the fluorine compound is adhered, as a fluorine compound, to the surfaces of the first external electrode and the second external electrode.
2. The multilayer ceramic capacitor as claimed in claim 1 , wherein the fluorine compound is a compound of which a mass to charge ratio “m/z” is 19 in a GC-MS analysis.
3. The multilayer ceramic capacitor as claimed in claim 1 , wherein there is a peak of a released amount of the fluorine compound, at a temperature of 380 degrees C. or more.
4. The multilayer ceramic capacitor as claimed in claim 1 , wherein the fluorine compound is adhered to a surface of the multilayer chip between the first external electrode and the second external electrode.
5. The multilayer ceramic capacitor as claimed in claim 1 , wherein the first external electrode and the second external electrode include a conductive resin layer including a metal component.
6. The multilayer ceramic capacitor as claimed in claim 5 ,
wherein a thickness of the conductive resin layer is 10 μm or more and 50 μm or less.
7. The multilayer ceramic capacitor as claimed in claim 1 , wherein the multilayer ceramic capacitor has a length of 1.0 mm or less, a width of 0.5 mm or less, and a height of 0.5 mm or less.
8. The multilayer ceramic capacitor as claimed in claim 1 , wherein the multilayer ceramic capacitor has a length of 3.2 mm or less, a width of 1.6 mm or less, and a height of 1.6 mm or less.
9. The multilayer ceramic capacitor as claimed in claim 1 , wherein the main component of the dielectric layers is CaZrO 3 .
10. The multilayer ceramic capacitor as claimed in claim 1 , wherein the main component of the dielectric layers is Ba 1-x-y Ca x Sr y Ti 1-z Zr z O 3 (0≤x≤1, 0≤y≤1, 0≤z≤1).
11. The multilayer ceramic capacitor as claimed in claim 1 , wherein a main component of the internal electrode layers is Ni.
12. The multilayer ceramic capacitor as claimed in claim 1 , wherein a main component of the internal electrode layers is Cu.
13. The multilayer ceramic capacitor as claimed in claim 1 ,
wherein each of the first external electrode and the second external electrode has a structure in which a plated layer is formed on a base layer, and
wherein a main component of the base layer is Ni.
14. The multilayer ceramic capacitor as claimed in claim 1 ,
wherein each of the first external electrode and the second external electrode has a structure in which a plated layer is formed on a base layer, and
wherein a main component of the base layer is Cu.
15. The multilayer ceramic capacitor as claimed in claim 1 , wherein the fluorine compound is adhered to at least a part of an upper face, a lower face and two side faces of the multilayer chip, between the first external electrode and the second external electrode,
wherein the upper face and the lower face are edge faces of the multilayer chip in a stacking direction.
16. The multilayer ceramic capacitor as claimed in claim 1 , wherein the fluorine compound covers a whole of surfaces of the multilayer ceramic capacitor.
17. The multilayer ceramic capacitor as claimed in claim 1 , wherein a number of the internal electrode layers is 100 to 500.