Method for manufacturing electronic-component
A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.
1. A method for manufacturing an electronic-component, the method comprising steps of:
forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers; and
singulating the plurality of laminates by removing the division portion, wherein
the forming the laminate substrate further comprising:
forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the plurality of insulator layers;
forming one of the plurality of insulator layers by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion; and
repeating, on the base material, the forming the insulator resist layer and the forming the one of the plurality insulator layers; and
the removing the division portion including removing the insulator resist portion during the singulating.
2. The method for manufacturing the electronic-component according to claim 1 , wherein
in the forming the laminate substrate, the laminate substrate is formed in such a way that the division portion has a width of 5 μm or more and 20 μm or less.
3. The method for manufacturing the electronic-component according to claim 1 , wherein
the forming the laminate substrate further comprising:
forming a conductor resist layer containing a conductive material, the conductive material being a constituent material of a conductor provided in each of the plurality of laminates; and
forming the conductor from the conductor resist layer by exposure and development, and
in the forming the insulator resist layer, the insulator resist layer is formed in such a way as to embed the conductor.
4. The method for manufacturing the electronic-component according to claim 3 wherein
each of the laminates includes at least a pair of faces that are adjacent to each other, and
the conductor is disposed on the pair of faces.
5. The method for manufacturing the electronic-component according to claim 3 , wherein
the forming the laminate substrate further comprising disposing a coil in each of plurality of laminates, and
the conductor is connected to the disposed coil.
6. The method for manufacturing the electronic-component according to claim 1 , wherein the forming the laminate substrate further comprising disposing a coil in each of plurality of laminates.
7. The method for manufacturing the electronic-component according to claim 6 , wherein
the disposed coil includes an axis extending along the lamination direction.