Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.
1. A printed circuit board assembly, comprising:
a print circuit board (PCB) having an upper surface directly facing the lower surface of the base, wherein the PCB comprises an array of conductive thermal pads on the upper surface of the PCB, a plurality of thermal vias within the PCB under the array of conductive thermal pads, a heat spreading structure mounted onto a lower surface of the PCB, wherein the heat spreading structure is in thermal contact with the plurality of thermal vias; and
a semiconductor package mounted on the array of conductive thermal pads, the semiconductor package comprising:
a base comprising an upper surface and a lower surface that is opposite to the upper surface;
a radio-frequency (RF) module embedded near the upper surface of the base;
an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation;
a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and
a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer, wherein the solder paste is in direct contact with the array of conductive thermal pads, wherein the array of conductive thermal pads comprises slits between the thermal pads and the slits are filled with the solder paste.
2. The printed circuit board assembly according to claim 1 , wherein the plurality of thermal vias comprises plated through holes.
3. The printed circuit board assembly according to claim 1 , wherein the heat spreading structure comprises a heat sink.
4. The printed circuit board assembly according to claim 1 , wherein the RF module comprises a top antenna layer and a bottom antenna layer spaced apart from the top antenna layer, and at least one dielectric layer interposed between the top antenna layer and the bottom antenna layer.
5. The printed circuit board assembly according to claim 1 , wherein the backside metal layer comprises Au.
6. The printed circuit board assembly according to claim 1 , wherein the solder paste comprises lead-free solder comprising tin, copper, silver, bismuth, indium, zinc, or antimony.
7. The printed circuit board assembly according to claim 1 , wherein the base comprises metal traces and vias for interconnection.
8. The printed circuit board assembly according to claim 7 , wherein the conductive structures are electrically connected to the RF module of the base through the metal traces and vias.
9. The printed circuit board assembly according to claim 1 , wherein the IC die is an RFIC die.
10. The printed circuit board assembly according to claim 1 further comprising:
an underfill disposed in a gap between the IC die and the lower surface of the base.
11. The printed circuit board assembly according to claim 10 , wherein a combined thickness of the underfill, the IC die, and the metal thermal interface layer is substantially equal to a ball height of the solder balls measured from the lower surface of the base.
12. The printed circuit board assembly according to claim 1 , wherein the solder paste is thicker than the backside metal layer.