IP Library Granted Patent US 11,705,498
Granted Patent B2
US 11,705,498 · App. 17/185,985 · Granted Jul 18, 2023

Nanowire transistor and method for fabricating the same

Inventors: Po-Kuang Hsieh (Kaohsiung, TW); Shih-Hung Tsai (Tainan, TW); Ching-Wen Hung (Tainan, TW); Chun-Hsien Lin (Tainan, TW)
Assignee: UNITED MICROELECTRONICS CORP.
H01L29/42392H01L29/0673H01L29/1606H01L29/45H01L29/66045H01L29/78696
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Quick Facts
Patent No.
US 11,705,498
App. No.
17/185,985
Granted
Jul 18, 2023
Kind
B2
Abstract

A method for fabricating a nanowire transistor includes the steps of first forming a nanowire channel structure on a substrate, in which the nanowire channel structure includes first semiconductor layers and second semiconductor layers alternately disposed over one another. Next, a gate structure is formed on the nanowire channel structure and then a source/drain structure is formed adjacent to the gate structure, in which the source/drain structure is made of graphene.

Claims (13)

1. A nanowire transistor, comprising:

a channel structure on a substrate;

a gate structure on and around the channel structure;

a source/drain structure adjacent to two sides of the gate structure;

an interlayer dielectric (ILD) layer around the gate structure; and

a contact plug in the ILD layer to electrically connect the source/drain structure, wherein the contact plug comprises grapheme and the contact plug further comprises:

a silicide layer on the source/drain structure;

a graphene layer on the silicide layer;

a barrier layer on the graphene layer; and

a metal layer on the barrier layer.

2. The nanowire transistor of claim 1 , wherein the source/drain structure comprises an epitaxial layer.

3. The nanowire transistor of claim 1 , wherein the channel structure is selected from the group consisting of silicon, germanium, doped silicon, doped germanium, and silicon germanium.

4. The nanowire transistor of claim 1 , further comprising a spacer adjacent to the gate structure, wherein a sidewall of the spacer is aligned with a sidewall of the channel structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2021
From: HSIEH, PO-KUANG; TSAI, SHIH-HUNG; HUNG, CHING-WEN; LIN, CHUN-HSIEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 055418/0540 →
Priority Claims (1)
CN 202110101854.9 · Jan 26, 2021 · national
Continuity (1)
Related Publication 20220238677A1 · Jul 28, 2022