IP Library › Granted Patent US 11,711,889
Granted Patent B2
US 11,711,889 · App. 17/211,796 · Granted Jul 25, 2023

Shield case and electronic circuit module

Inventor: Mitsuhiro Nakamura (Yokohama, JP)
Assignee: LAPIS Semiconductor Co., Ltd.
H05K1/023H05K3/3442H05K9/0028
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Quick Facts
Patent No.
US 11,711,889
App. No.
17/211,796
Granted
Jul 25, 2023
Kind
B2
Abstract

A shield case, joined to a circuit board on which electronic components are mounted and covering the electronic components, has a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion. Each of the plurality of terminal leg portions has: a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board; and an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board.

Claims (21)

1. A shield case, joined to a circuit board and covering an electronic component mounting surface zone of the circuit board, comprising:

a top plate portion covering the electronic components; and

a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion; wherein

each of the plurality of terminal leg portions has:

a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board;

an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board, wherein the expansion terminal portion has a joined portion; and

a recessed portion on a joined surface of each of the terminal portions that is joined to the circuit board or on the bottom surface of the joined portion.

2. The shield case according to claim 1 , wherein the joined portion is bent in a direction intersecting with the end surface of the circuit board and which has a bottom surface along a back surface opposite to the mounting surface.

3. The shield case according to claim 1 , further comprising a penetration hole on the joined surface of each of the terminal portions that is joined to the circuit board or on the bottom surface of the joined portion.

4. The shield case according to claim 1 , wherein the joined portion elongating in a direction parallel to the end surface of the circuit board.

5. The shield case according to claim 1 , further comprising a side plate portion formed in a way of projecting in the direction intersecting with the top plate portion from the peripheral edge portion of the top plate portion except the plurality of terminal leg portions.

6. The shield case according to claim 2 , further comprising a penetration hole on the joined surface of each of the terminal portions that is joined to the circuit board or on the bottom surface of the joined portion.

7. The shield case according to claim 2 , wherein each of the expansion terminal portions abuts against the end surface of the circuit board.

8. The shield case according to claim 2 , wherein each of the expansion terminal portions is separated from the end surface of the circuit board.

9. An electronic circuit module, comprising:

a circuit board having an electronic component mounting surface zone; and a shield case that is joined to the circuit board and covers the electronic component mounting surface zone of the circuit board; wherein

the shield case has: a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion;

each of the plurality of terminal leg portions has:

a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board;

an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board, wherein the expansion terminal portion has a joined portion; and

a recessed portion on a joined surface of each of the terminal portions that is joined to the circuit board or on the bottom surface of the joined portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2021
From: NAKAMURA, MITSUHIRO
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 055707/0788 →
Priority Claims (1)
JP 2020-057114 · Mar 27, 2020 · national
Continuity (1)
Related Publication 20210307154A1 · Sep 30, 2021