Memory electrodes and formation thereof

1. A method for forming a memory cell, comprising:

forming a stack of materials including a first electrode material, a first dielectric lamina material, a select-element material, and a second electrode material, wherein the first dielectric lamina material is between the first electrode material and the select-element material, and wherein the select-element material is between the first dielectric lamina material and the second electrode;

wherein forming the stack of materials comprises changing a first lateral dimension of a first portion, proximate to the first dielectric lamina material, of the first electrode material to be less than a second lateral dimension of a second portion, distal from the first dielectric lamina material, of the first electrode material and to be less than a lateral dimension of the select- element material.

2. The method of claim 1 , wherein forming the stack of materials further comprises:

etching partially through the first electrode material thereby forming the second lateral dimension of the second portion of the first electrode material;

depositing a protective liner over the partially etched first electrode material;

removing a portion of the protective liner; and

anisotropically etching the first electrode material beneath the removed portion of the protective liner.

3. The method of claim 2 , wherein forming the stack of materials further comprises tapering walls of the first electrode material remaining after the anisotropic etch of the first electrode material beneath the removed portion of the protective liner by reducing a radius of curvature of the walls from the second lateral dimension of the second portion to the first lateral dimension of a first portion utilizing a diffusion process to replace regions of the walls with a dielectric material.

4. The method of claim 2 , wherein forming the stack of materials further comprises tapering walls of the first electrode material remaining after the anisotropic etch of the first electrode material beneath the removed portion of the protective liner by reducing a radius of curvature of the walls from the second lateral dimension of the second portion to the first lateral dimension of a first portion by oxidizing regions of the walls with a dielectric material.

5. The method of claim 1 , wherein forming the stack of materials further comprises:

etching through the first dielectric lamina material, the select-element material, and a second dielectric lamina material between the select-element material and the second electrode material;

depositing a protective liner around the first electrode material, the first dielectric lamina material, the select-element material, and the second dielectric lamina material;

etching partially through the second electrode material;

changing a lateral dimension of a first portion, proximate to an interface with the second dielectric lamina material, of the second electrode material to be less than the lateral dimension of the select-element material by a diffusion process replacing a region within the first portion of the second electrode with a dielectric material; and

anisotropically etching through a second portion of the second electrode to define a lateral dimension of the second portion that is greater than the lateral dimension of the first portion.

6. The method of claim 1 , wherein changing the first lateral dimension of the first portion of the first electrode material to be less than the second lateral dimension of the second portion of the first electrode material and to be less than a lateral dimension of the select- element material, further comprises changing the first lateral dimension of the first portion of the first electrode material along a first axis and changing the first lateral dimension of the first portion of the first electrode material along a second axis perpendicular to the first axis.

7. A method for forming a memory cell, comprising:

forming a stack of materials, the stack of materials including a first electrode material, a select-element material, a first dielectric lamina material between the first electrode material and the select-element material, a second electrode material, and a second dielectric lamina material between the select-element material and the second electrode material,

wherein forming the stack of materials comprises changing a lateral dimension of a first portion of the first electrode by reducing a radius of curvature of walls of the first portion of the first electrode at an interface with the first dielectric lamina material.

8. The method of claim 7 , wherein forming the stack of materials further comprises:

etching partially through the first electrode material thereby forming a lateral dimension of a second portion of the first electrode material;

depositing a protective liner over the partially etched first electrode material; and

removing a portion of the protective liner.

9. The method of claim 8 , wherein reducing the radius of curvature of the first electrode material at the interface with the first dielectric lamina material comprises laterally etching the first portion of the first electrode material, previously covered by the removed portion of the protective liner, to taper the first electrode material from the lateral dimension of the second portion of the first electrode to a tip having a lateral dimension smaller than the lateral dimension of the second portion of the first electrode.

10. The method of claim 9 , wherein forming the stack of materials further comprises:

filling a laterally etched-away region of the first portion of the first electrode material with a dielectric material;

etching through the first dielectric lamina material, the select-element material, and the second dielectric lamina material;

reducing a radius of curvature of the second electrode material at an interface with the second dielectric lamina material by isotropically etching a portion of the second electrode; and

filling an etched-away region of the portion of the second electrode with a dielectric material.