Repair compound and methods of use
A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
1. A repair compound comprising:
a latex resin or resin binder;
a thickener;
hydrophobic fibrillated fibers and hydrophilic fibers; and
a filler material,
wherein the thickener is a hydrophilic alkali swellable emulsion present in an amount of no greater than about 1% by weight of the total repair compound,
wherein the hydrophobic fibrillated fibers include polyethylene fibers, the hydrophilic fibers include rayon fibers, or both,
and wherein the hydrophobic fibrillated fibers have a nominal length and the hydrophilic fibers have a nominal length, and the hydrophobic fibrillated fiber nominal length is less than the hydrophilic fiber nominal length, wherein the repair compound exhibits pseudoplastic behavior and has a density of not greater than 4.0 lbs/gal.
2. The repair compound of claim 1 , wherein the latex resin or resin binder is 100% acrylate.
3. The repair compound of claim 1 , wherein each of the hydrophobic fibrillated fibers and hydrophilic fibers are present in an amount of less than about 1 percent by weight of the total repair compound.
4. The repair compound of claim 1 , wherein the hydrophobic fibrillated fiber nominal length is at least 10 times less than the hydrophilic fiber nominal length.
5. The repair compound of claim 1 , wherein the filler material includes a synthetic inorganic filler.
6. The repair compound of claim 5 , wherein the synthetic inorganic filler comprises a bimodal particle size mixture of larger synthetic inorganic filler particles and smaller synthetic inorganic filler particles, the mixture having a particle size ratio of larger size synthetic inorganic filler particles to smaller size synthetic inorganic filler particles of at least about 5:1.
7. The repair compound of claim 5 , wherein the synthetic inorganic filler is comprised of substantially spherical particles.
8. The repair compound of claim 7 , wherein the synthetic inorganic filler is glass bubbles.
9. The repair compound of claim 1 , wherein the repair compound further comprises titanium dioxide and wherein the titanium dioxide is present in an amount of between about 5% by weight and about 20% by weight.
10. A kit including the repair compound of claim 1 , a tool for spreading the repair compound, and optionally a backing device for establishing a scaffolding structure.
11. A method for repairing a hole in a surface, the method comprising:
providing the repair compound of claim 1 ;
spreading a quantity of the repair compound into a hole; and
allowing the repair compound to harden.
12. The method of claim 11 , further comprising abrading the hardened compound.
13. The method of claim 11 , further comprising inserting a backing device for establishing a scaffolding structure into the hole.
14. The method of claim 11 , wherein spreading the quantity of repair compound into the hole further comprises spreading the quantity of the repair compound along a surface surrounding the hole.
15. The method of claim 11 , further comprising shaping the quantity of repair compound by hand.