IP Library › Granted Patent US 11,715,729
Granted Patent B2
US 11,715,729 · App. 17/244,471 · Granted Aug 1, 2023

Display module and method of manufacturing the same

Inventors: Yoonsuk Lee (Suwon-si, KR); Eunhye Kim (Suwon-si, KR); Sangmoo Park (Suwon-si, KR); Dongyeob Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L25/167H01L24/26H01L24/32H01L24/83H01L24/05H01L24/29H01L33/40H01L2224/05639H01L2224/05644H01L2224/05647H01L2224/05655H01L2224/08501H01L2224/26145H01L2224/29105H01L2224/29109H01L2224/29111H01L2224/29113H01L2224/29118H01L2224/29124H01L2224/29139H01L2224/29147H01L2224/29155H01L2224/29386H01L2224/29393H01L2224/32145H01L2224/32501H01L2224/83203
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Quick Facts
Patent No.
US 11,715,729
App. No.
17/244,471
Granted
Aug 1, 2023
Kind
B2
Abstract

A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.

Claims (38)

1. A display module comprising:

a glass substrate;

a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer comprising a plurality of TFT electrode pads;

a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs comprising LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and

a light shielding member provided on the TFT layer and between the plurality of LEDs,

wherein the light shielding member has a plurality of openings for individually isolating the plurality of LEDs,

wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer,

wherein the LED electrode pads and the plurality of TFT electrode pads are electrically and physically connected to each other by an adhesive applied to the plurality of openings, and

wherein the adhesive comprises flux particles, and the flux particles comprise one or more of: an inorganic flux containing zinc chloride and zinc chloride-ammonia chloride; an organic flux containing glutamic acid hydrochloride urea and ethylene diamine stearic acid hydrochloride; a rosin-based flux containing inactive/active rosin; or a water-soluble flux containing salt, acid, and amine.

2. The display module according to claim 1 , wherein the height of the light shielding member with respect to the TFT layer is higher than a height of the TFT electrode pads with respect to the TFT layer.

3. The display module according to claim 1 , wherein a size of each of the plurality of openings is larger than a size of each of the plurality of LEDs.

4. The display module according to claim 1 , wherein the light shielding member has a mesh structure.

5. The display module according to claim 1 , wherein the adhesive comprises anisotropic conductive paste or an anisotropic conductive film.

6. The display module according to claim 1 , wherein the adhesive comprises a non-conductive paste or a non-conductive film.

7. The display module according to claim 1 , wherein each of the LED electrode pads comprises a stacked structure of a first layer and a second layer,

wherein the first layer comprises one of Au, Cu, Ni, or Al, and

wherein the second layer comprises one of Au, Ni, Ti, Cr, Pd, TiN, Ta, TiW, TaN, AlSiTiN, NiTi, TiBN, ZrBN, TiAlN, or TiB2.

8. The display module according to claim 7 , wherein the TFT electrode pads comprise one of Au, Cu, Ag, Ni, Ni/Au, Au/Ni, Ni/Cu, or Cu/Ni.

9. The display module according to claim 8 , wherein the adhesive is melted together with the second layer of the LED electrode pads and the TFT electrode pads to form a metal compound.

10. The display module according to claim 9 , wherein the adhesive consists essentially of Sn or In.

11. The display module according to claim 9 , wherein the adhesive comprises two or more of Sn, Ag, In, Cu, Ni, Au, Cu, Bi, Al, Zn, or Ga.

12. A display module comprising:

a glass substrate;

a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer comprising a plurality of TFT electrode pads;

a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs comprising LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and

a light shielding member provided on the TFT layer and between the plurality of LEDs,

wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer, and

wherein the light shielding member comprises:

a photosensitive resin composition comprising a binder resin, a photopolymerization initiator, a black pigment, and a solvent; or

a resin composition including a black pigment.

13. A display module comprising:

a glass substrate;

a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer comprising a plurality of TFT electrode pads;

a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs comprising LED electrode pads that are electrically connected to respective electrode pads among the plurality of TFT electrode pads;

a light shielding member provided on the TFT layer as a mesh structure having a plurality of openings, the light shielding member having a height with respect to the TFT layer that is lower than a height of the plurality of LEDs with respect to the TFT layer; and

an adhesive provided in the plurality of openings and electrically and physically connecting the LED electrode pads and the plurality of TFT electrode pads to each other,

wherein the adhesive comprises flux particles, and the flux particles comprise one or more of: an inorganic flux containing zinc chloride and zinc chloride-ammonia chloride, an organic flux containing glutamic acid hydrochloride urea and ethylene diamine stearic acid hydrochloride, a rosin-based flux containing inactive/active rosin, or a water-soluble flux containing salt, acid, and amine.

14. The display module according to claim 13 , wherein the adhesive comprises one of anisotropic conductive paste, anisotropic conductive film, non-conductive paste, or non-conductive film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2021
From: LEE, YOONSUK; KIM, EUNHYE; PARK, SANGMOO; LEE, DONGYEOB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 056088/0216 →
Priority Claims (1)
KR 10-2020-0057580 · May 14, 2020 · national
Continuity (1)
Related Publication 20210358896A1 · Nov 18, 2021