Method of producing ceramic electronic component and ceramic electronic component

1. A method of producing a ceramic electronic component, comprising:

baking a first electrode paste containing a metal powder at a first temperature to form a first electrode layer at a first region of a ceramic body;

baking a second electrode paste containing a metal powder of a same type as the metal powder in the first electrode paste at a second temperature lower than the first temperature to form a second electrode layer at a second region different from the first region of the ceramic body; and

applying a physical shock treatment to a surface of the second electrode layer to densify a surface layer portion of the second electrode layer; wherein

the applying the physical shock treatment includes the physical shock treatment being applied to only the surface of the second electrode layer.

2. The method of producing a ceramic electronic component according to claim 1 , wherein a resistance electrode paste is baked to form a resistance electrode layer at the second region of the ceramic body, and the second electrode layer is formed on a surface of the resistance electrode layer.

3. The method of producing a ceramic electronic component according to claim 2 , wherein a baking temperature of the resistance electrode paste is between the first temperature and the second temperature.

4. The method of producing a ceramic electronic component according to claim 2 , wherein the ceramic body includes end surfaces that oppose each other in a length direction and each defining the second region, and lateral surfaces that oppose each other in a width direction and each defining the first region, the first electrode layer is formed on each lateral surface, and the resistance electrode layer and the second electrode layer are formed on each end surface.

5. The method of producing a ceramic electronic component according to claim 1 , wherein the ceramic body includes at least a pair of a first internal electrode layer and a second internal electrode layer, and a ceramic dielectric layer between the first internal electrode layer and the second internal electrode layer, each defining a capacitor.

6. The method of producing a ceramic electronic component according to claim 5 , wherein the first electrode layer is electrically connected to the first internal electrode layer, and the second electrode layer is electrically connected to the second internal electrode layer.

7. The method of producing a ceramic electronic component according to claim 1 , wherein the method further comprises plating surfaces of the first electrode layer and the second electrode layer after densification of the surface layer portion of the second electrode layer.

8. The method of producing a ceramic electronic component according to claim 1 , wherein the physical shock treatment includes sandblasting.

9. A ceramic electronic component comprising:

a ceramic body;

a first electrode layer provided in a first region of the ceramic body; and

a second electrode layer provided in a second region different from the first region of the ceramic body; wherein the first electrode layer and the second electrode layer contain metals of a same type;

the metals of the same type in the first electrode layer and the second electrode layer have different densities;

the density of the metal in a surface layer portion of the second electrode layer is higher than the density of the metal in an inner portion of the second electrode layer; and

the density of the metal in the first electrode layer as a whole is higher than the density of the metal in the second electrode layer as a whole.

10. The ceramic electronic component according to claim 9 , the first electrode layer is provided on a lateral surface of the ceramic body.

11. The ceramic electronic component according to claim 9 , wherein the second electrode layer is provided on an end surface of the ceramic body.

12. The ceramic electronic component according to claim 9 , further comprising:

a resistance electrode layer provided between the ceramic body and the second electrode layer; wherein

the resistance electrode layer has a higher electrical resistivity than the second electrode layer.

13. The ceramic electronic component according to claim 9 , wherein the surface layer portion of the second electrode layer is defined by about 20% of the second electrode layer in a thickness direction, and the inner portion of the second electrode layer is defined by about 80% of the second electrode layer in the thickness direction.

14. The ceramic electronic component according to claim 9 , wherein a difference in densities between the surface layer portion and the inner portion of the second electrode layer is about 2% or more and about 5% or less.

15. The ceramic electronic component according to claim 9 , wherein a density of the first electrode layer is about 80% or more and about 93% or less.

16. The ceramic electronic component according to claim 9 , wherein a density of the surface layer portion of the second electrode layer is about 80% or more and about 90% or less.

17. The ceramic electronic component according to claim 9 , wherein a density of the inner portion of the second electrode layer is about 75% or more and about 80% or less.

18. The ceramic electronic component according to claim 9 , wherein the first electrode layer and the second electrode layer each contain Cu.

19. The ceramic electronic component according to claim 9 , wherein a thickness of each of the first and second electrode layers is about 5 μm or more and about 50 μm or less.

20. The ceramic electronic component according to claim 9 , further comprising a thin electrode layer between the ceramic body and the second electrode layer.