Semiconductor device and manufacturing method thereof
A semiconductor device includes a first stacked body including a plurality of first semiconductor chips stacked along a first direction, each of the first semiconductor chips being offset from the other first semiconductor chips along a second direction perpendicular to the first direction; a first columnar electrode connected to an electrode pad of the first stacked body, and extending in the first direction; a second stacked body including a plurality of second semiconductor chips stacked along the first direction, each of the second semiconductor chips being offset from the other second semiconductor chips along the second direction, the second stacked body having a height larger than the first stacked body and overlap at least a portion of the first stacked body when viewed from the top; and a second columnar electrode connected to an electrode pad of the second stacked body, and extending in the first direction.
1. A semiconductor device comprising:
a first stacked body including a plurality of first semiconductor chips stacked along a first direction, each of the first semiconductor chips being offset from the other first semiconductor chips along a second direction perpendicular to the first direction;
a first columnar electrode connected to an electrode pad of the first stacked body, and extending in the first direction;
a second stacked body including a plurality of second semiconductor chips stacked along the first direction, each of the second semiconductor chips being offset from the other second semiconductor chips along the second direction, the second stacked body having a height larger than the first stacked body and overlap at least a portion of the first stacked body when viewed from the top; and
a second columnar electrode connected to an electrode pad of the second stacked body, and extending in the first direction.
2. The semiconductor device according to claim 1 , wherein
the second stacked body overlaps at least a portion of the first stacked body at a portion of the second stacked body whose height exceeds that of the first stacked body.
3. The semiconductor device according to claim 1 , wherein
at least one of the plurality of second semiconductor chips has a thickness that is thicker than the other second semiconductor chips, or the second stacked body includes a spacer has a thickness that is thicker than each of the second semiconductor chips, and
the second stacked body overlaps at least a portion of the first stacked body based on the larger thickness of the at least one second semiconductor chip or the thickness of the spacer.
4. The semiconductor device according to claim 3 , wherein
the at least one second semiconductor chip or the spacer is substantially at a position in the first direction the same as a position of at least one of the first semiconductor chips in the first direction.
5. The semiconductor device according to claim 3 , wherein the spacer is disposed below a bottommost one of the second semiconductor chips.
6. The semiconductor device according to claim 1 , wherein
the first columnar electrode is coupled to each of the first semiconductor chips, and
the second columnar electrode is coupled to each of the second semiconductor chips.
7. The semiconductor device according to claim 1 , further comprising:
a redistribution layer electrically connected to the first columnar electrode and the second columnar electrode.
8. The semiconductor device according to claim 7 , further comprising:
one or more metal bumps disposed on a first side of the redistribution layer, wherein the first columnar electrode and the second columnar electrode are disposed on a second side of the redistribution layer opposite to the first side.
9. The semiconductor device according to claim 1 , further comprising:
a wiring substrate electrically connected to the first columnar electrode and the second columnar electrode via a first connection bump.
10. The semiconductor device according to claim 9 , further comprising:
a third semiconductor chip disposed on the second stacked body; and
a second connection bump connected to an electrode pad of the third semiconductor chip.
11. The semiconductor device according to claim 9 , wherein the first columnar electrode, second columnar electrode, and first connection bump are disposed on a same side of the wiring substrate.
12. The semiconductor device according to claim 1 , wherein one or more of the second semiconductor chips are disposed above the first stacked body, and an upper one of the one or more second semiconductor chips is disposed closer to the first stacked body along the second direction than a lower one of the one or more second semiconductor chips.
13. A manufacturing method of a semiconductor device, comprising:
forming, on a support substrate, a first stacked body including a plurality of first semiconductor chips stacked along a first direction, each of the first semiconductor chips being offset from the other first semiconductor chips along a second direction perpendicular to the first direction;
forming a second stacked body including a plurality of second semiconductor chips stacked along the first direction, each of the second semiconductor chips being offset from the other second semiconductor chips along the second direction, the second stacked body having a height greater than the first stacked body and overlapping at least a portion of the first stacked body when viewed from the top;
forming a first columnar electrode connected to an electrode pad of the first stacked body and extending in the first direction; and
forming a second columnar electrode connected to an electrode pad of the second stacked body and extending in the first direction.
14. The manufacturing method of the semiconductor device according to claim 13 , further comprising:
covering the first stacked body, the second stacked body, the first columnar electrode, and the second columnar electrode with a resin layer;
polishing the resin layer to expose upper ends of the first columnar electrode and the second columnar electrode; and
forming, on the resin layer, a redistribution layer electrically coupled to the first columnar electrode and the second columnar electrode.
15. The manufacturing method of the semiconductor device according to claim 14 , further comprising:
forming one or more metal bumps over the redistribution layer to electrically couple the first and second columnar electrodes to the one or more metal bumps via the redistribution layer.
16. The manufacturing method of the semiconductor device according to claim 14 , wherein one or more of the second semiconductor chips are disposed above the first stacked body, and an upper one of the one or more second semiconductor chips is disposed closer to the first stacked body along the second direction than a lower one of the one or more second semiconductor chips.
17. The manufacturing method of the semiconductor device according to claim 13 , further comprising:
covering the first stacked body, the second stacked body, the first columnar electrode, and the second columnar electrode with a resin layer;
polishing the resin layer to expose upper ends of the first columnar electrode and the second columnar electrode;
forming first connection bumps on the upper ends of the first columnar electrode and the second columnar electrode; and
coupling the first columnar electrode and the second columnar electrode to a wiring substrate via the first connection bumps.