Chip antenna module
A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
1. A chip antenna module comprising:
a substrate comprising an upper surface pad disposed on a first surface of the substrate and a feed pad disposed on the first surface of the substrate;
a chip antenna configured to transmit a radio-frequency signal, electrically connected to the feed pad, and bonded to the upper surface pad; and
an electronic element mounted on a second surface of the substrate,
wherein the chip antenna comprises:
a first ceramic substrate bonded to the upper surface pad;
a second ceramic substrate opposing the first ceramic substrate;
a first patch disposed on the first ceramic substrate; and
a second patch disposed on the second ceramic substrate, and
the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
2. The chip antenna module of claim 1 , wherein the chip antenna further comprises a spacer disposed between the first ceramic substrate and the second ceramic substrate to space the first ceramic substrate and the second ceramic substrate apart from each other.
3. The chip antenna module of claim 1 , wherein the chip antenna further comprises a bonding layer disposed between the first ceramic substrate and the second ceramic substrate to space the first ceramic substrate and the second ceramic substrate apart from each other.
4. The chip antenna module of claim 1 , wherein the chip antenna has a width extending in a first direction and a length extending in a second direction perpendicular to the first direction.
5. The chip antenna module of claim 1 , wherein the substrate further comprises a ground layer disposed on the first surface of the substrate.
6. The chip antenna module of claim 5 , wherein the ground layer is disposed in a region of the first surface of the substrate other than a region of the first surface of the substrate in which the upper surface pad is disposed.
7. The chip antenna module of claim 1 , wherein the substrate further comprises a ground layer configured to reflect the radio-frequency signal transmitted by the chip antenna in a target direction.
8. A chip antenna module comprising:
a substrate comprising a plurality of layers, the plurality of layers comprising:
a first external layer disposed on a first surface of the substrate,
a second external layer disposed on a second surface of the substrate, and
at least one internal layer disposed between the first external layer and the second external layer; and
a chip antenna disposed on the first surface of the substrate,
wherein the chip antenna is configured to transmit a radio-frequency (RF) signal and comprises:
a first ceramic substrate mounted on the first surface of the substrate;
a second ceramic substrate opposing the first ceramic substrate;
a first patch disposed on the first ceramic substrate; and
a second patch disposed on the second ceramic substrate, and
one layer of the at least one internal layer is a ground layer configured to reflect the RF signal transmitted by the chip antenna in a target direction.
9. The chip antenna module of claim 8 , wherein the substrate further comprises a ground via connected to the ground layer, and
the ground via extends to the first surface of the substrate from the ground layer.
10. The chip antenna module of claim 9 , wherein the substrate further comprises a shielding wall protruding from the first surface of the substrate.
11. The chip antenna module of claim 10 , wherein the ground via further extends from the first surface of the substrate into the shielding wall.
12. The chip antenna module of claim 8 , wherein the substrate further comprises a plurality of ground vias connected to the ground layer, and
the plurality of ground vias extend to the first surface of the substrate from the ground layer.
13. A chip antenna module comprising:
a substrate comprising an upper surface pad disposed on a first surface of the substrate;
a chip antenna configured to transmit a radio-frequency signal and bonded to the upper surface pad; and
an electronic element mounted on a second surface of the substrate,
wherein the chip antenna comprises:
a first ceramic substrate bonded to the upper surface pad;
a second ceramic substrate opposing the first ceramic substrate;
a first patch disposed on the first ceramic substrate; and
a second patch disposed on the second ceramic substrate, and
the first ceramic substrate and the second ceramic substrate are spaced apart from each other, and
wherein the substrate further comprises a ground layer disposed on the first surface of the substrate.
14. The chip antenna module of claim 13 , wherein the chip antenna further comprises a spacer disposed between the first ceramic substrate and the second ceramic substrate to space the first ceramic substrate and the second ceramic substrate apart from each other.
15. The chip antenna module of claim 13 , wherein the chip antenna further comprises a bonding layer disposed between the first ceramic substrate and the second ceramic substrate to space the first ceramic substrate and the second ceramic substrate apart from each other.
16. The chip antenna module of claim 13 , wherein the chip antenna has a width extending in a first direction and a length extending in a second direction perpendicular to the first direction.
17. The chip antenna module of claim 13 , wherein the ground layer is disposed in a region of the first surface of the substrate other than a region of the first surface of the substrate in which the upper surface pad is disposed.
18. The chip antenna module of claim 13 , wherein the substrate further comprises a ground layer configured to reflect the radio-frequency signal transmitted by the chip antenna in a target direction.
19. A chip antenna module comprising:
a substrate comprising an upper surface pad disposed on a first surface of the substrate;
a chip antenna configured to transmit a radio-frequency signal and bonded to the upper surface pad; and
an electronic element mounted on a second surface of the substrate,
wherein the chip antenna comprises:
a first ceramic substrate bonded to the upper surface pad;
a second ceramic substrate opposing the first ceramic substrate;
a first patch disposed on the first ceramic substrate; and
a second patch disposed on the second ceramic substrate, and
the first ceramic substrate and the second ceramic substrate are spaced apart from each other, and
wherein the substrate further comprises a ground layer configured to reflect the radio-frequency signal transmitted by the chip antenna in a target direction.
20. The chip antenna module of claim 19 , wherein the chip antenna further comprises a spacer disposed between the first ceramic substrate and the second ceramic substrate to space the first ceramic substrate and the second ceramic substrate apart from each other.
21. The chip antenna module of claim 19 , wherein the chip antenna further comprises a bonding layer disposed between the first ceramic substrate and the second ceramic substrate to space the first ceramic substrate and the second ceramic substrate apart from each other.
22. The chip antenna module of claim 19 , wherein the chip antenna has a width extending in a first direction and a length extending in a second direction perpendicular to the first direction.
23. The chip antenna module of claim 19 , wherein the ground layer is disposed in a region of the first surface of the substrate other than a region of the first surface of the substrate in which the upper surface pad is disposed.