Organopolysiloxane cured film, use thereof, and method for producing same
An organopolysiloxane cured film which can be made thin, has an extremely low number of defects on a surface and inside of the film, and exhibits high dielectric breakdown strength with regard to a load voltage is provided. Also provided are applications thereof and a method of manufacturing. The organopolysiloxane cured film has an average thickness within a range of 1 to 200 μm. In general, the number of surface defects is 0 to 1, and the number of internal defects is 0 to 20, when measuring the number of surface defects using optical means in an arbitrary position on the organopolysiloxane cured film with a unit area of 15 mm×15 mm. The organopolysiloxane cured film may be obtained by a rolling step in a clean room or the like, or may be obtained by curing between separators provided with a release layer.
1. An organopolysiloxane cured film having an average thickness within a range of 1 to 200 μm, wherein a number of surface defects is within a range of 0 to 1 when measuring the number of surface defects using an optical means in an arbitrary position on the organopolysiloxane cured film with a unit area of 15 mm×15 mm, wherein the organopolysiloxane cured film is obtained by curing a curable organopolysiloxane composition, and wherein the curable organopolysiloxane composition comprises:
(A) an organopolysiloxane mixture, containing:
(a1) a straight chain or branched chain organopolysiloxane having an alkenyl group only at an end of a molecular chain; and
(a2) an organopolysiloxane resin containing an alkenyl group having at least one branched siloxane unit in a molecule wherein the amount of vinyl (CH 2 ═CH—) groups is within a range of 1.0 to 5.0 mass %;
(B) an organohydrogenpolysiloxane composition having at least two silicon-bonded hydrogen atoms in a molecule in an amount containing 0.1 to 2.5 moles of silicon-bonded hydrogen atoms with regard to a total amount of 1 mol of the carbon-carbon bonds in the composition; and
(C) an effective amount of a hydrosilylation reaction catalyst.
2. The organopolysiloxane cured film according to claim 1 , wherein a number of internal defects is within a range of 0 to 20 when measuring the number of internal defects using an optical means in an arbitrary position on the organopolysiloxane cured film with a unit area of 15 mm×15 mm.
3. The organopolysiloxane cured film according to claim 1 , wherein a dielectric breakdown strength measured at room temperature is within a range of 60 V/μm to 200 V/μm.
4. The organopolysiloxane cured film according to claim 1 , which is transparent, and wherein the average thickness is within a range of 1 to 150 μm.
5. The organopolysiloxane cured film according to claim 1 , obtained by a rolling process or step.
6. The organopolysiloxane cured film according to claim 1 , having a flattened surface obtained by curing between separators having a release layer.
7. The organopolysiloxane cured film according to claim 1 , obtained by curing the curable organopolysiloxane composition in a clean room.
8. An electronic material or a member for a displaying device comprising or formed from the organopolysiloxane cured film according to claim 1 .
9. A laminated body having a structure where the organopolysiloxane cured film according to claim 1 is laminated onto a sheet-like substrate provided with a release layer.
10. An electronic component or displaying device, comprising the organopolysiloxane cured film according to claim 1 .
11. A method of manufacturing the organopolysiloxane cured film according to claim 1 , the method comprising a step of applying the curable organopolysiloxane composition onto a substrate and then performing a rolling process or step prior to or after curing of the curable organopolysiloxane composition.
12. A method of manufacturing the organopolysiloxane cured film according to claim 1 , the method comprising a step of curing the curable organopolysiloxane composition while sandwiched between separators having a release layer.
13. The method according to claim 11 , wherein the rolling process or step occurs in a clean room.
14. The method according to claim 12 , wherein the step of curing occurs in a clean room.