Direct frequency tuning for matchless plasma source in substrate processing systems
A drive circuit for providing RF power to a component of a substrate processing system includes a plasma source operating at a first frequency. A load includes the component of the substrate processing system. An impedance network connects the plasma source to the load. A current sensor senses current at an output of the plasma source. A voltage sensor senses voltage at the output of the plasma source. A controller includes a tuned frequency calculator configured to calculate a tuned frequency for the plasma source based on the voltage, the current, and a configuration of the impedance network and to adjust the first frequency based on the tuned frequency.
1. A drive circuit for providing RF power to a component of a substrate processing system, comprising:
a plasma source operating at a first frequency;
an impedance network;
a load including the component of the substrate processing system, wherein the impedance network connects the plasma source to the load;
a current sensor to sense current at an output of the plasma source;
a voltage sensor to sense voltage at the output of the plasma source; and
a controller including a tuned frequency calculator configured to:
calculate a tuned frequency for the plasma source based on the voltage, the current and a configuration of the impedance network; and
adjust the first frequency based on the tuned frequency;
wherein the plasma source comprises a matchless plasma source that includes,
a clock generator to generate a clock signal at the first frequency;
a gate driver to receive the clock signal;
a half bridge circuit including:
a first switch with a control terminal connected to the gate driver, a first terminal and a second terminal;
a second switch with a control terminal connected to the gate driver, a first terminal connected to the second terminal of the first switch and an output node, and a second terminal; and
a DC supply connected to the half bridge circuit.
2. The drive circuit of claim 1 , wherein the plasma source supplies RF plasma power to a coil of the substrate processing system.
3. The drive circuit of claim 1 , wherein the plasma source supplies an RF bias to a substrate support of the substrate processing system.
4. The drive circuit of claim 1 , wherein the DC supply includes:
a first DC supply to supply a first voltage potential to the first terminal of the first switch; and
a second DC supply to supply a second voltage potential to the second terminal of the second switch, wherein the first voltage potential and the second voltage potential have opposite polarity and are approximately equal in magnitude.
5. The drive circuit of claim 1 , wherein the clock signal includes a square wave signal.
6. The drive circuit of claim 1 , wherein the controller further includes:
a phase offset calculator to calculate a phase offset between the voltage and the current: and
a clock adjuster to adjust the first frequency based on the phase offset after adjusting the first frequency using the tuned frequency calculator.
7. The drive circuit of claim 6 , wherein the clock adjuster increases the first frequency when the current leads the voltage and decreases the first frequency when the voltage leads the current.
8. The drive circuit of claim 1 , wherein the controller further includes a frequency adjuster to iteratively adjust the first frequency to increase a magnitude of the current after adjusting the first frequency using the tuning frequency calculator.
9. A method for providing RF power to a component of a substrate processing system, comprising:
arranging an impedance network between a plasma source and a load, wherein the plasma source operates at a first frequency, and the load includes the component of the substrate processing system;
sensing current at an output of the plasma source;
sensing voltage at the output of the plasma source;
calculating a tuned frequency for the plasma source based on the voltage, the current: and a configuration of the impedance network; and
adjusting the first frequency based on the tuned frequency;
wherein the plasma source comprises a matchless plasma source that includes,
a clock generator to generate a clock signal at the first frequency;
a gate driver to receive the clock signal;
a half bridge circuit including:
a first switch with a control terminal connected to the gate driver, a first terminal and a second terminal;
a second switch with a control terminal connected to the gate driver, a first terminal connected to the second terminal of the first switch and an output node, and a second terminal; and
a DC supply connected to the half bridge circuit.
10. The method of claim 9 , further comprising supplying RF plasma power to a coil of the substrate processing system.
11. The method of claim 9 , further comprising supplying an RF bias to a substrate support of the substrate processing system.
12. The method of claim 9 , wherein the DC supply includes:
a first DC supply to supply a first voltage potential to the first terminal of the first switch; and
a second DC supply to supply a second voltage potential! to the second terminal of the second switch, wherein the first voltage potential and the second voltage potential have opposite polarity and are approximately equal in magnitude.
13. The method of claim 9 , wherein the clock signal includes a square wave signal.
14. The method of claim 9 , further comprising:
calculating a phase offset between the voltage and the current; and
adjusting the first frequency based on the phase offset after adjusting the first frequency based on the tuned frequency.
15. The method of claim 14 , further comprising increasing the first frequency when the current leads the voltage and decreasing the first frequency when the voltage leads the current.
16. The method of claim 9 , further comprising iteratively adjusting the first frequency to increase a magnitude of the current after adjusting the first frequency.