IP Library › Granted Patent US 11,729,533
Granted Patent B2
US 11,729,533 · App. 17/430,842 · Granted Aug 15, 2023

Solid-state image sensor

Inventors: Takashi Moue (Kanagawa, JP); Yosuke Ueno (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
H04N25/772H04N25/57H04N25/709H04N25/75
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,729,533
App. No.
17/430,842
Granted
Aug 15, 2023
Kind
B2
Abstract

A solid-state image sensor includes: an input transistor configured to output, from a drain, a drain voltage according to an input voltage input to a source in a case where the input voltage substantially coincides with a predetermined reference voltage input to a gate; and an output transistor configured to output a signal indicating whether or not a difference between the input voltage input to a source and the drain voltage input to a gate exceeds a predetermined threshold voltage as a comparison result between the input voltage and the reference voltage.

Claims (39)

1. An imaging device comprising:

a pixel circuit configured to output a pixel signal;

a pixel signal line coupled to the pixel circuit;

a reference signal generation circuit configured to output a reference signal; and

a comparator including:

a first transistor, wherein a gate of the first transistor is coupled to the reference signal generation circuit and a source of the first transistor is coupled to the pixel signal line, and

a second transistor, wherein a gate of the first second transistor is coupled to a drain of the first transistor and a source of the second transistor is electrically connected to the pixel signal line.

2. The imaging device according to claim 1 , wherein the source of the first transistor and the source of the second transistor are configured to receive a voltage, the voltage corresponding to the pixel signal.

3. The imaging device according to claim 1 , the comparator including:

a third transistor, wherein a drain of the third transistor is coupled to the pixel signal line and a source of the third transistor is coupled to the drain of the first transistor.

4. The imaging device according to claim 3 , wherein a gate of the third transistor is configured to receive a bias voltage.

5. The imaging device according to claim 1 , the comparator including:

a third transistor, wherein a gate of the third transistor is coupled to the drain of the first transistor and a source of the third transistor is coupled to the pixel signal line.

6. The imaging device according to claim 5 , wherein the gate of the third transistor is coupled to a drain of the third transistor.

7. The imaging device according to claim 5 , wherein a bottom gate of the third transistor is coupled to the source of the third transistor.

8. The imaging device according to claim 5 , the comparator further comprising:

a fourth transistor, wherein a drain of the fourth transistor is coupled to the pixel signal line and a source of the fourth transistor is coupled to a drain of the second transistor.

9. The imaging device according to claim 8 , wherein a gate of the fourth transistor is configured to receive a bias voltage.

10. The imaging device according to claim 1 , wherein a bottom gate of the first transistor is connected to the source of the first transistor and a bottom gate of the second transistor is connected to the source of the second transistor.

11. The imaging device according to claim 1 , wherein the pixel is disposed in a first substrate and the comparator is disposed in a second substrate which is bonded to the first substrate.

12. The imaging device according to claim 11 , wherein the first substrate and the second substrate are electrically connected by a through silicon via.

13. The imaging device according to claim 11 , wherein the first substrate and the second substrate are electrically connected by a direct bonding.

14. A comparator comprising:

a first input configured to receive a pixel signal;

a second input configured to receive a reference signal;

a first transistor, wherein a gate of the first transistor is coupled to the reference signal generation circuit and a source of the first transistor is coupled to the first input; and

a second transistor, wherein a gate of the second transistor is coupled to a drain of the first transistor and a source of the second transistor is electrically connected to the first input.

15. The comparator according to claim 14 , wherein the source of the first transistor and the source of the second transistor are configured to receive a voltage, the voltage corresponding to the pixel signal.

16. The comparator according to claim 14 , comprising:

a third transistor, wherein a drain of the third transistor is coupled to the first input and a source of the third transistor is coupled to the drain of the first transistor.

17. The imaging device according to claim 16 , wherein a gate of the third transistor is configured to receive a bias voltage.

18. The comparator according to claim 14 , comprising:

a third transistor, wherein a gate of the third transistor is coupled to the drain of the first transistor and a source of the third transistor is coupled to the first input.

19. The comparator according to claim 18 , wherein the gate of the third transistor is coupled to a drain of the third transistor.

20. The comparator according to claim 18 , wherein a bottom gate of the third transistor is coupled to the source of the third transistor.

21. The comparator according to claim 18 , the comparator further comprising:

a fourth transistor, wherein a drain of the fourth transistor is coupled to the first input and a source of the fourth transistor is coupled to a drain of the second transistor.

22. The comparator according to claim 21 , wherein a gate of the fourth transistor is configured to receive a bias voltage.

23. The comparator according to claim 14 , wherein a bottom gate of the first transistor is connected to the source of the first transistor and a bottom gate of the second transistor is connected to the source of the second transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2021
From: MOUE, TAKASHI; UENO, YOSUKE
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 057202/0854 →
Priority Claims (1)
JP 2019-028965 · Feb 21, 2019 · national
Continuity (1)
Related Publication 20220166949A1 · May 26, 2022
Cited By (2)
US 12,283,926 US 12,696,011