Sensor package
A sensor package comprises a non-conductive substrate, at least two electrically conductive coils located at a first side of the non-conductive substrate, an evaluation circuit located at a second side of the non-conductive substrate opposing the first side of the non-conductive substrate and conductive connections between the at least two electrically conductive coils and the evaluation circuit.
1. A sensor package comprising:
a non-conductive substrate;
at least two electrically conductive coils located at a first side of the non-conductive substrate;
an evaluation circuit located at a second side of the non-conductive substrate opposing the first side of the non-conductive substrate; and
conductive connections between the at least two electrically conductive coils and the evaluation circuit,
wherein the evaluation circuit is configured to determine a position of the target and/or a change of position of the target,
wherein the at least two electrically conductive coils include a transmitting coil and a plurality of receiving coils,
wherein an area covered by the transmitting coil is larger than an area covered by at least one of the receiving coils,
wherein the plurality of receiving coils are arranged on an outer circumference of the transmitting coil which has a shape of a circle such that the areas of each of the plurality of receiving coils at least partially overlaps with the area of the transmitting coil, and
wherein center points of the plurality of receiving coils are distributed along the outer circumference of the transmitting coil.
2. The sensor package according to claim 1 , wherein the substrate comprises an electrically isolating, non-metallic, and/or low dielectric loss material.
3. The sensor package according to claim 1 , wherein the substrate is configured to impart substantial structural rigidity or wherein a lead-frame is configured to impart structural rigidity.
4. The sensor package according to claim 1 , wherein the substrate comprises connection pads on the second side of the substrate for connecting the at least two electrically conductive coils with the evaluation circuit.
5. The sensor package according to claim 1 , wherein the evaluation circuit is mounted as a flip chip onto the second side of the substrate.
6. The sensor package according to claim 1 , wherein the at least two electrically conductive coils are integrated at least partially into the substrate on the first side of the substrate.
7. The sensor package according to claim 1 , wherein the at least two electrically conductive coils do not structurally overlap each other or at least partially structurally overlap each other.
8. The sensor package according to claim 1 , wherein one of the at least two electrically conductive coils produces a magnetic field and the other of the at least two electrically conductive coils receives the magnetic field.
9. The sensor package according to claim 1 , wherein the evaluation circuit is a semiconductor device.
10. The sensor package according to claim 1 , further comprising:
a lead frame arranged only on the second side of the substrate.
11. The sensor package according to claim 10 , wherein the evaluation circuit is connected to the lead frame by wire bonds or mounted as a flip chip onto the lead frame or wherein the evaluation circuit is connected to the lead frame via the substrate.
12. The sensor package according to claim 1 , wherein the at least two electrically conductive coils on the first side of the substrate define a first area and wherein the evaluation circuit is arranged on the second side of the substrate within a second area directly opposing the first area.
13. The sensor package according to claim 1 , further comprising:
at least one terminal, wherein the at least one terminal is one of a supply terminal, an input terminal and an output terminal, wherein the at least one terminal is connected to the evaluation circuit and/or to at least one of the at least two electrically conductive coils.
14. The sensor package according to claim 1 , further comprising:
at least one passive component that is located at the second side of the non-conductive substrate.
15. The sensor package according to claim 1 , wherein the sensor package is encapsulated by mold material.
16. The sensor package according to claim 1 , wherein the evaluation circuit is configured to determine a rotational position of the target.
17. The sensor package according to claim 1 , wherein the evaluation circuit is configured to determine a linear position of the target.
18. The sensor package according to claim 1 , wherein the evaluation circuit is configured to determine a linear movement of the target.
19. The sensor package according to claim 1 , wherein the evaluation circuit is configured to determine a rotational movement of the target.
20. The sensor package according to claim 1 , wherein the evaluation circuit is configured to determine a rotational position of the target, a linear position of the target, a linear movement of the target, and a rotational movement of the target.
21. The sensor package according to claim 1 , wherein the center points of the plurality of receiving coils are uniformly distributed along the outer circumference of the transmitting coil.
22. The sensor package according to claim 1 , wherein the at least two electrically conductive coils include at least one transmitting coil and at least one receiving coil,
wherein the at least one receiving coil is configured to couple inductively with the at least one transmitting coil, and
wherein the at least one receiving coil is configured for receiving a magnetic field that is influenced by the target in a predetermined direction, wherein the predetermined direction is defined by a predetermined structure of the target, the predetermined structure of the target influencing magnetic field lines of a magnetic field transmitted by the at least one transmitting coil.
23. The sensor package according to claim 1 , wherein the at least two electrically conductive coils include at least one transmitting coil that transmits a magnetic field and at least one receiving coil,
wherein the at least one receiving coil is configured to couple inductively with the at least one transmitting coil, and
wherein the at least one receiving coil is arranged for accounting for different impinging field situations of the magnetic field due to a geometry of structures of the target.
24. A sensor package comprising:
a non-conductive substrate;
at least two electrically conductive coils located at a first side of the non-conductive substrate;
an evaluation circuit located at a second side of the non-conductive substrate opposing the first side of the non-conductive substrate; and
conductive connections between the at least two electrically conductive coils and the evaluation circuit,
wherein the evaluation circuit is configured to determine a position of the target and/or a change of position of the target
wherein the at least two electrically conductive coils include a transmitting coil and a plurality of receiving coils,
wherein an area covered by the transmitting coil is larger than an area covered by at least one of the receiving coils,
wherein the plurality of receiving coils are arranged on an outer circumference of the transmitting coil such that the areas of each of the plurality of receiving coils at least partially overlap with the area of the transmitting coil
wherein center points of the plurality of receiving coils are distributed along the outer circumference of the transmitting coil.