IP Library › Granted Patent US 11,734,946
Granted Patent B2
US 11,734,946 · App. 17/338,706 · Granted Aug 22, 2023

Fingerprint sensing module

Inventors: Chao-Chien Chiu (Hsinchu, TW); Shuo-Hong Wang (Hsinchu, TW); Shih-Hua Lu (Hsinchu, TW); Hsun-Chen Chu (Hsinchu, TW); Yan-Liang Chen (Hsinchu, TW)
Assignee: Au Optronics Corporation
G06V40/1318G06F3/042H01L27/1462H01L27/14621H01L27/14623H01L27/14627H01L27/14645H01L27/14678
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Quick Facts
Patent No.
US 11,734,946
App. No.
17/338,706
Granted
Aug 22, 2023
Kind
B2
Abstract

A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.

Claims (49)

1. A fingerprint sensing module having a plurality of sensing pixel areas, and comprising:

a first substrate;

an active device, disposed on the first substrate;

a photosensitive element layer, disposed on the first substrate, and electrically connected to the active device;

a collimation structure layer, disposed on the photosensitive element layer;

a second substrate, disposed on the collimation structure layer;

a plurality of microlenses, disposed on a side surface of the collimation structure layer facing away from the photosensitive element layer, and overlapping the photosensitive element layer, wherein the microlenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in the sensing pixel areas;

a spacer pattern, extending between the microlens groups; and

a sealant layer, surrounding the sensing pixel areas, wherein the sealant layer, the microlenses and the spacer pattern are located between the collimation structure layer and the second substrate, and the collimation structure layer is spaced apart from the second substrate by the spacer pattern.

2. The fingerprint sensing module according to claim 1 , wherein the spacer pattern surrounds each of the microlens groups.

3. The fingerprint sensing module according to claim 1 , wherein the spacer pattern extends between any adjacent two of the microlenses.

4. The fingerprint sensing module according to claim 3 , wherein the spacer pattern comprises:

a plurality of columnar portions, disposed respectively in the sensing pixel areas; and

a plurality of extension portions, extending between the microlenses and the columnar portions.

5. The fingerprint sensing module according to claim 1 , further comprising a light-shielding pattern layer disposed on the second substrate and comprising a plurality of openings, wherein the openings respectively overlap the microlenses.

6. The fingerprint sensing module according to claim 1 , further comprising a filter layer disposed between the photosensitive element layer and the collimation structure layer.

7. The fingerprint sensing module according to claim 1 , further comprising:

a light-shielding pattern layer, disposed on the second substrate, wherein the spacer pattern is disposed on the second substrate.

8. The fingerprint sensing module according to claim 7 , further comprising a color filter layer, located between the photosensitive element layer and the light-shielding pattern layer.

9. The fingerprint sensing module according to claim 1 , further comprising:

an auxiliary layer, covering the microlenses and located between the microlenses and the spacer pattern.

10. A fingerprint sensing module, comprising:

a first substrate;

a photosensitive element layer, disposed on the first substrate;

a collimation structure layer, disposed on the photosensitive element layer;

a second substrate, disposed on the collimation structure layer;

a plurality of microlenses, disposed between the collimation structure layer and the second substrate, and overlapping the photosensitive element layer;

a spacer pattern, overlapping part of the microlenses; and

a sealant layer, surrounding the sensing pixel areas, wherein the sealant layer, the microlenses and the spacer pattern are located between the collimation structure layer and the second substrate, and the collimation structure layer is spaced apart from the second substrate by the spacer pattern.

11. The fingerprint sensing module according to claim 10 , further comprising a plurality of sensing pixel areas, wherein the microlenses are divided into a plurality of microlens groups, the microlens groups are respectively located in the sensing pixel areas, and the spacer pattern surrounds each of the microlens groups.

12. The fingerprint sensing module according to claim 10 , further comprising a filter layer disposed on the second substrate and located between the microlenses and the second substrate.

13. The fingerprint sensing module according to claim 10 , wherein the microlenses are disposed on the second substrate, and the spacer pattern is disposed on a side surface of the collimation structure layer facing away from the photosensitive element layer.

14. The fingerprint sensing module according to claim 10 , further comprising:

a light-shielding pattern layer disposed on the second substrate and comprising a plurality of openings, wherein the microlenses are disposed on a side surface of the collimation structure layer facing away from the photosensitive element layer, and the spacer pattern is disposed on the second substrate and is located in part of the openings of the light-shielding pattern layer.

15. The fingerprint sensing module according to claim 10 , further comprising:

a light-shielding pattern layer disposed on the second substrate and comprising a plurality of openings, wherein the microlenses are disposed on a side surface of the collimation structure layer facing away from the photosensitive element layer, and overlap respectively part of the openings of the light-shielding pattern layer.

16. A fingerprint sensing module, comprising:

a first substrate;

a photosensitive element layer, disposed on the first substrate;

a collimation structure layer, disposed on the photosensitive element layer;

a second substrate, disposed on the collimation structure layer;

a plurality of microlenses, disposed between the collimation structure layer and the second substrate, and overlapping the photosensitive element layer;

a light-shielding pattern layer, comprising a plurality of first openings, and the first openings respectively overlapping the microlenses;

a flat layer, not overlapping the microlenses; and

a spacer pattern, adapted to overlap the flat layer, wherein the flat layer is located between the spacer pattern and the light-shielding pattern layer.

17. The fingerprint sensing module according to claim 16 , wherein the light-shielding pattern layer, the flat layer, and the spacer pattern are disposed on the second substrate.

18. The fingerprint sensing module according to claim 16 , further comprising a plurality of sensing pixel areas, wherein the microlenses are divided into a plurality of microlens groups, the microlens groups are respectively located in the sensing pixel areas, and the flat layer and the spacer pattern surround each of the microlens groups.

19. The fingerprint sensing module according to claim 18 , wherein the flat layer and the spacer pattern further extend between any adjacent two of the microlenses disposed in at least one direction.

20. The fingerprint sensing module according to claim 16 , wherein the flat layer completely covers the light-shielding pattern layer and comprises a plurality of second openings overlapping the first openings.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2021
From: CHIU, CHAO-CHIEN; WANG, SHUO-HONG; LU, SHIH-HUA; CHU, HSUN-CHEN; CHEN, YAN-LIANG
To: AU OPTRONICS CORPORATION
Reel/Frame 056449/0222 →
Priority Claims (2)
TW 110104319 · Feb 4, 2021 · national
TW 110113292 · Apr 13, 2021 · national
Continuity (3)
Provisional Application 63070880 · Aug 27, 2020
Provisional Application 63066391 · Aug 17, 2020
Related Publication 20220050987A1 · Feb 17, 2022