IP Library › Granted Patent US 11,736,856
Granted Patent B2
US 11,736,856 · App. 17/510,477 · Granted Aug 22, 2023

Earphone device

Inventors: Wen-Hong Wang (Taichung, TW); Ching-Feng Lin (Taichung, TW); Chia-Chien Chen (Taichung, TW); Po-Cheng Huang (Taichung, TW); Shih-Hsien Yang (Taichung, TW); Cheng-Kun Chiang (Taichung, TW); Ching-Hsin Chen (Taichung, TW); Ching-Chieh Lin (Taichung, TW); Che-Hao Liao (Taichung, TW)
Assignee: Jabil Circuit (Singapore) Pte. Ltd.
H04R1/1075H04R1/1016H04R1/1025H04R1/1041
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Quick Facts
Patent No.
US 11,736,856
App. No.
17/510,477
Granted
Aug 22, 2023
Kind
B2
Abstract

An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.

Claims (23)

1. An earphone device comprising:

a speaker unit;

an inner housing body covering said speaker unit through an insert molding technique; and

an outer housing body covering said inner housing body through the insert molding technique.

2. The earphone device as claimed in claim 1 , further comprising an electrical circuit module that is electrically coupled to said speaker unit, said inner housing body including a first housing member and a second housing member that are separable from each other, said first housing member and said second housing member respectively covering said speaker unit and said electrical circuit module through the insert molding technique.

3. The earphone device as claimed in claim 1 , further comprising a battery and an accommodating base, said inner housing body covering said accommodating base through the insert molding technique, said accommodating base being formed with an inner space, therein, said battery being disposed in said inner space.

4. The earphone device as claimed in claim 3 , further comprising an electrical circuit module that is electrically coupled to said speaker unit, and a pair of electrodes that are electrically coupled to said electrical circuit module, said electrical circuit module and said pair of said electrodes being mounted to said accommodating base before covered by said inner housing body through the insert molding technique, said pair of said electrodes being exposed to said inner space of said accommodating base, and being in electrical contact with said battery so that said battery is electrically coupled to said electrical circuit module.

5. The earphone device as claimed in claim 1 , wherein at least one of said inner housing body and said outer housing body is made from a liquid silicone rubber material.

6. The earphone device as claimed in claim 1 , wherein a hardness of said outer housing body is different from that of said inner housing body.

7. The earphone device as claimed in claim 1 , wherein said outer housing body defines a shape of said earphone device.

8. The earphone device as claimed in claim 1 , wherein at least one of said inner housing body and said outer housing body is made of a thermoplastic material.

9. An earphone device comprising:

a plurality of electronic components electrically coupled to each other;

an inner housing body including at least two housing members that respectively cover at least two of said electronic components through an insert molding technique; and

an outer housing body covering said at least two housing members through the insert molding technique.

10. The earphone device as claimed in claim 9 , wherein said electronic components includes a speaker unit, an electrical circuit module and a pair of electrodes.

11. The earphone device as claimed in claim 10 , wherein said at least two housing members of said inner housing body includes a first housing member and a second housing member separable from each other, said first housing member and said second housing member respectively covering said speaker unit and said electrical circuit module through the insert molding technique.

12. The earphone device as claimed in claim 10 , further comprising a battery and an accommodating base, said inner housing body covering said accommodating base through the insert molding technique, said accommodating base being formed with an inner space therein, said battery being disposed in said inner space.

13. The earphone device as claimed in claim 12 , wherein said electrical circuit module and said pair of said electrodes are mounted to said accommodating base before covered by said inner housing body through the insert molding technique, said pair of said electrodes being exposed to said inner space of said accommodating base, and being in electrical contact with said battery so that said battery is electrically coupled to said electrical circuit module.

14. The earphone device as claimed in claim 9 , wherein at least one of said inner housing body and said outer housing body is made from a liquid silicone rubber material.

15. The earphone device as claimed in claim 9 , wherein a hardness of said outer housing body is different from that of said inner housing body.

16. The earphone device as claimed in claim 9 , wherein said outer housing body defines a shape of said earphone device.

17. The earphone device as claimed in claim 9 , wherein at least one of said inner housing body and said outer housing body is made of a thermoplastic material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2021
From: WANG, WEN-HONG; LIN, CHING-FENG; CHEN, CHIA-CHIEN; HUANG, PO-CHENG; YANG, SHIH-HSIEN; CHIANG, CHENG-KUN; CHEN, CHING-HSIN; LIN, CHING-CHIEH; LIAO, CHE-HAO
To: JABIL CIRCUIT (SINGAPORE) PTE. LTD.
Reel/Frame 057910/0968 →
Priority Claims (1)
CN 202022458115.9 · Oct 29, 2020 · national
Continuity (1)
Related Publication 20220141570A1 · May 5, 2022
Cited By (1)
US 1,073,649