IP Library Granted Patent US 11,743,608
Granted Patent B2
US 11,743,608 · App. 17/371,751 · Granted Aug 29, 2023

Imaging unit, imaging apparatus, and computer readable medium storing thereon an imaging control program

Inventor: Shiro Tsunai (Kawasaki, JP)
Assignee: NIKON CORPORATION
H04N25/57H01L27/1464H01L27/14621H01L27/14627H01L27/14634H01L27/14636H01L27/14645H04N25/533H04N25/585H04N25/71H04N25/75H04N25/79
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,743,608
App. No.
17/371,751
Granted
Aug 29, 2023
Kind
B2
Abstract

When the amplification ratio is low and strong incident light causes a large charge, the signal retrieved from regions where the incident light is weak is also weak, but when the amplification ratio is high in regions where the incident light is weak, the signal retrieved from regions where the incident light is strong becomes saturated. Therefore, the dynamic range of the imaging unit is narrow. Provided is an imaging unit comprising an imaging section that includes a first group having one or more pixels and a second group having one or more pixels different from those of the first group; and a control section that, while a single charge accumulation is performed in the first group, causes pixel signals to be output by performing charge accumulation in the second group a number of times differing from a number of times charge accumulation is performed in the first group.

Claims (51)

1. An imaging sensor comprising:

a first semiconductor substrate having a plurality of pixels; and

a second semiconductor substrate having a driving section that outputs a first control signal for controlling at least a first pixel among the plurality of pixels, and a second control signal for controlling at least a second pixel among the plurality of pixels.

2. The imaging sensor according to claim 1 , wherein

the first pixel is connected to a first control wire to which the first control signal is output; and

the second pixel is connected to a second control wire to which the second control signal is output.

3. The imaging sensor according to claim 2 , wherein

the first pixel includes a first transfer section that is connected to the first control wire, and transfers a photoelectrically converted charge based on the first control signal, and

the second pixel includes a second transfer section that is connected to the second control wire, and transfers a photoelectrically converted charge based on the second control signal.

4. The imaging sensor according to claim 3 , wherein

the driving section outputs a third control signal for controlling the first pixel, and a fourth control signal for controlling the second pixel,

the first pixel is connected to a third control wire to which the third control signal is output, and

the second pixel is connected to a fourth control wire to which the fourth control signal is output.

5. The imaging sensor according to claim 4 , wherein

the first pixel includes a first reset section that is connected to the third control wire, and resets a potential of a first floating diffusion to which a photoelectrically converted charge is transferred, based on the third control signal, and

the second pixel includes a second reset section that is connected to the fourth control wire, and resets a potential of a second floating diffusion to which a photoelectrically converted charge is transferred, based on the fourth control signal.

6. The imaging sensor according to claim 5 , further comprising

a first output wire that is connected to the first pixel, and outputs a first signal based on a photoelectrically converted charge; and

a second output wire that is connected to the second pixel, and outputs a second signal based on a photoelectrically converted charge.

7. The imaging sensor according to claim 6 , wherein

the first semiconductor substrate includes a first load current source that is connected to the first output wire, and a second load current source that is connected to the second output wire.

8. The imaging sensor according to claim 6 , wherein

the second semiconductor substrate includes a first load current source that is connected to the first output wire, and a second load current source that is connected to the second output wire.

9. The imaging sensor according to claim 6 , wherein

the second semiconductor substrate includes a first conversion circuit for converting the first signal that has been output to the first output wire into a digital signal, and a second conversion circuit for converting the second signal that has been output to the second output wire into a digital signal.

10. The imaging sensor according to claim 9 , further comprising

a third semiconductor substrate that includes

a first storing section that stores the first signal that has been converted into a digital signal by the first conversion circuit, and

a second storing section that stores the second signal that has been converted into a digital signal by the second conversion circuit.

11. The imaging sensor according to claim 2 , wherein

the first pixel includes a first reset section that is connected to the first control wire, and resets a potential of a first floating diffusion to which a photoelectrically converted charge is transferred, based on the first control signal, and

the second pixel includes a second reset section that is connected to the second control wire, and resets a potential of a second floating diffusion to which a photoelectrically converted charge is transferred, based on the second control signal.

12. The imaging sensor according to claim 11 , further comprising

a first output wire that is connected to the first pixel, and outputs a first signal based on a photoelectrically converted charge; and

a second output wire that is connected to the second pixel, and outputs a second signal based on a photoelectrically converted charge.

13. The imaging sensor according to claim 12 , wherein

the first semiconductor substrate includes a first load current source that is connected to the first output wire, and a second load current source that is connected to the second output wire.

14. The imaging sensor according to claim 12 , wherein

the second semiconductor substrate includes a first load current source that is connected to the first output wire, and a second load current source that is connected to the second output wire.

15. The imaging sensor according to claim 12 , wherein

the second semiconductor substrate includes a first conversion circuit for converting the first signal that has been output to the first output wire into a digital signal, and a second conversion circuit for converting the second signal that has been output to the second output wire into a digital signal.

16. The imaging sensor according to claim 15 , further comprising

a third semiconductor substrate that includes

a first storing section that stores the first signal that has been converted into a digital signal by the first conversion circuit, and

a second storing section that stores the second signal that has been converted into a digital signal by the second conversion circuit.

17. An imaging apparatus comprising

the imaging sensor of claim 1 .

18. An imaging apparatus comprising

the imaging sensor of claim 9 .

19. An imaging apparatus comprising

the imaging sensor of claim 15 .

Priority Claims (2)
JP 2012-082312 · Mar 30, 2012 · national
JP 2012-128092 · Jun 5, 2012 · national
Continuity (6)
Continuation 16844231 · Apr 9, 2020
Continuation 15946168 · Apr 5, 2018
Continuation 15401683 · Jan 9, 2017
Continuation 14500030 · Sep 29, 2014
Continuation PCTJP2013002148 · Mar 28, 2013
Related Publication 20210337141A1 · Oct 28, 2021