Electronics packaging for phase change cooling systems
An electronics system packaging/enclosure can include an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, where the condensing chassis is situated on top of the internal chassis. The electronics system packaging can include a condenser unit housed in the condensing chassis to condense a vapor into a two-phase liquid coolant, and IT electronics housed within the internal chassis, where the internal chassis is at least partially submerged within the two-phase liquid coolant, where, heat generated within the internal chassis is transferred to the two-phase liquid coolant thereby causing at least some of the two-phase liquid coolant to turn into a vapor.
1. An electronics system packaging, the electronic system packaging comprising:
an external chassis;
an internal chassis housed within the external chassis;
a condenser chassis housed within the external chassis, the condenser chassis situated on top of the internal chassis;
a condenser unit housed in the condenser chassis to condense a two-phase coolant from a vapor phase to a liquid phase;
information technology (IT) electronics housed within the internal chassis, wherein the IT electronics are at least partially submerged within the liquid phase of the two-phase coolant and wherein, when the IT electronics operate, the IT electronics generate heat that is transferred to the liquid phase of the two-phase coolant thereby causing at least some of the liquid phase to turn into the vapor phase; and
a two-phase coolant management module housed within the external chassis but outside the internal chassis, wherein the two-phase coolant management module is coupled between a first inlet port of the external chassis and an inlet port of the internal chassis, and wherein the two-phase coolant management module is to regulate a flow of the liquid phase of the two-phase coolant from a coolant unit to the IT electronics within the internal chassis.
2. The electronics system packaging of claim 1 , further comprising a liquid level sensor coupled to the internal chassis to sense a level of the liquid phase of the two-phase coolant contained within the internal chassis.
3. The electronics system packaging of claim 2 , wherein the liquid level sensor is coupled to the two-phase coolant management module to cause the two-phase coolant management module to regulate a flow of the liquid phase of the two-phase coolant.
4. The electronics system packaging of claim 2 , further comprising a cooling liquid management module housed within the external chassis but outside of the condenser chassis.
5. The electronics system packaging of claim 4 , wherein the cooling liquid management module couples a second inlet port of the external chassis to an inlet port of the condenser chassis, and wherein the cooling liquid management module is to regulate a flow of a cooling liquid to the condenser unit within the condenser chassis.
6. The electronics system packaging of claim 2 , wherein the liquid level sensor is coupled to the two-phase coolant management module and the cooling liquid management module to cause the two-phase coolant management module to regulate a flow of the liquid phase of the two-phase coolant and to cause the cooling liquid management module to regulate a flow of the cooling liquid.
7. The electronics system packaging of claim 1 , wherein the internal chassis housed within the external chassis comprises a plurality of internal chassis, wherein each of the plurality of internal chassis houses corresponding IT electronics that provide IT services.
8. The electronics system packaging of claim 7 , wherein each of the plurality of internal chassis comprises a corresponding fluid level sensor coupled to the internal chassis and a corresponding two-phase coolant management module, wherein the corresponding fluid level sensor to cause the corresponding two-phase coolant management module to regulate a flow of the liquid phase of the two-phase coolant from a coolant unit to the internal chassis.
9. An information technology (IT) equipment cooling system, comprising:
a coolant unit to supply a liquid phase of a two-phase coolant, the two-phase coolant also having a vapor phase; and
a cooling loop to deliver cooling liquid; and
an electronics system packaging coupled to the coolant unit and connected to the cooling loop, the electronics system packaging comprising:
an external chassis;
an internal chassis housed within the external chassis;
a condenser chassis housed within the external chassis, the condenser chassis situated on top of the internal chassis;
a condenser unit housed in the condenser chassis to condense the two-phase coolant from the vapor phase to the liquid phase; and
information technology (IT) electronics housed within the internal chassis, wherein the IT electronics are at least partially submerged within the liquid phase of the two-phase coolant and wherein, while the IT electronics provide IT services, the IT electronics generate heat that is transferred to the liquid phase of the two-phase coolant thereby causing at least some of the liquid phase to turn into the vapor phase; and
a two-phase coolant management module housed within the external chassis but outside the internal chassis, wherein the two-phase coolant management module is coupled between a first inlet port of the external chassis and an inlet port of the internal chassis, and wherein the two-phase coolant management module is to regulate a flow of the liquid phase of the two-phase coolant from the coolant unit to the IT electronics within the internal chassis.
10. The IT equipment cooling system of claim 9 , further comprising a liquid level sensor coupled to the internal chassis to sense a level of the liquid phase of the two-phase coolant contained within the internal chassis.
11. An electronics system packaging, the electronic system packaging comprising:
an external chassis;
an internal chassis housed within the external chassis;
a condenser chassis housed within the external chassis, the condenser chassis situated on top of the internal chassis;
a condenser unit housed in the condenser chassis to condense a vapor phase of a two-phase coolant into a liquid phase of the two-phase coolant;
information technology (IT) electronics housed within the internal chassis, wherein the IT electronics are at least partially submerged within the liquid phase of the two-phase coolant and wherein, when the IT electronics operate, the IT electronics generate heat that is transferred to the liquid phase of the two-phase coolant thereby causing at least some of the liquid phase to turn into the vapor phase; and
a cooling liquid management module housed within the external chassis but outside the condenser chassis, wherein the cooling liquid management module couples a second inlet port of the external chassis to an inlet port of the condenser chassis, and wherein the cooling liquid management module is to regulate a flow of cooling liquid to the condenser unit within the condenser chassis.
12. The electronics system packaging of claim 11 , further comprising a liquid level sensor coupled to the internal chassis to sense a level of the liquid phase of the two-phase coolant contained within the internal chassis.
13. The electronics system packaging of claim 12 , wherein the liquid level sensor is to cause a two-phase coolant management module to regulate a flow of the liquid phase of the two-phase coolant and is to cause the cooling liquid management module to regulate a flow of the cooling liquid.
14. The electronics system packaging of claim 11 , wherein the internal chassis housed within the external chassis comprises a plurality of internal chassis, wherein each of the plurality of internal chassis houses corresponding IT electronics that provide IT services.
15. The electronics system packaging of claim 14 , wherein each of the plurality of internal chassis comprises a corresponding fluid level sensor coupled to the internal chassis and a corresponding two-phase coolant management module, wherein the corresponding fluid level sensor to cause the corresponding two-phase coolant management module to regulate a flow of the liquid phase of the two-phase coolant from a coolant unit to the internal chassis.
16. An information technology (IT) equipment cooling system, comprising:
a coolant unit to supply a liquid phase of a two-phase coolant, the two-phase coolant also having a vapor phase; and
a cooling loop to deliver cooling liquid; and
an electronics system packaging coupled to the coolant unit and connected to the cooling loop, the electronics system packaging comprising:
an external chassis;
an internal chassis housed within the external chassis;
a condenser chassis housed within the external chassis, the condenser chassis situated on top of the internal chassis;
a condenser unit housed in the condenser chassis to condense the two-phase coolant from the vapor phase to the liquid phase; and
information technology (IT) electronics housed within the internal chassis, wherein the IT electronics are at least partially submerged within the liquid phase of the two-phase coolant and wherein, while the IT electronics provide IT services, the IT electronics generate heat that is transferred to the liquid phase of the two-phase coolant thereby causing at least some of the liquid phase to turn into the vapor phase; and
a cooling liquid management module housed within the external chassis but outside the condenser chassis, wherein the cooling liquid management module couples a second inlet port of the external chassis to an inlet port of the condenser chassis, and wherein the cooling liquid management module is to regulate a flow of cooling liquid to the condenser unit within the condenser chassis.
17. The IT equipment cooling system of claim 16 , further comprising a liquid level sensor coupled to the internal chassis to sense a level of the liquid phase of the two-phase coolant contained within the internal chassis.