Laminated electronic component

1. A laminated electronic component comprising:

a body including a magnetic layer containing magnetic particles;

a coil provided within the body; and

outer electrodes provided on a bottom surface of the body and each electrically connected to any one of end portions of the coil, wherein

in a cross-section perpendicular to the bottom surface of the body, each outer electrode has a first outer surface facing outward from the bottom surface of the body and a second outer surface facing into the body, and a side surface of each outer electrode has a recess-shaped wedge portion, and a part of the body enters the wedge portion,

the side surface of each outer electrode having the recess-shaped wedge portion has a first extension portion at the bottom surface of the body, and a second extension portion nearest to the first extension portion and deeper into the body, which configure the wedge portion, and respective lengths of the first and second extension portions are about the same,

the first extension portion has a first outer surface facing outward from the body that is part of the first outer surface of the outer electrode, and the second extension portion has a second outer surface facing into the body that is part of the second outer surface of the electrode, and

at the bottom surface of the body, at least a part of a surface of each outer electrode is located outward of the bottom surface of the body.

2. The laminated electronic component according to claim 1 , wherein

the coil includes a first coil and a second coil, and

the outer electrodes include a first outer electrode, a second outer electrode, a third outer electrode, and a fourth outer electrode each electrically connected to any one of end portions of the first coil and the second coil.

3. The laminated electronic component according to claim 2 , wherein a length of the wedge portion is from about 10 μm to about 50 μm.

4. The laminated electronic component according to claim 2 , wherein

each outer electrode includes a base electrode layer containing Ag, and one or more plating layers provided on the base electrode layer, and

the base electrode layer has the wedge portion.

5. The laminated electronic component according to claim 2 , wherein

each outer electrode has, on a surface thereof that is in contact with the bottom surface of the body, a recess recessed inward from the surface, and a part of the body enters the recess, and

a width of the recess is smaller at an inlet end of the recess than within the recess.

6. The laminated electronic component according to claim 2 , wherein a thickness of each outer electrode is from about 5 μm to about 100 μm.

7. The laminated electronic component according to claim 2 , wherein an end portion of the coil that is located at a top side of the body is electrically connected to the outer electrode via a connection portion provided at an outer side portion of a wound portion of the coil.

8. The laminated electronic component according to claim 1 , wherein a length of the wedge portion is from about 10 μm to about 50 μm.

9. The laminated electronic component according to claim 8 , wherein

each outer electrode includes a base electrode layer containing Ag, and one or more plating layers provided on the base electrode layer, and

the base electrode layer has the wedge portion.

10. The laminated electronic component according to claim 8 , wherein

each outer electrode has, on a surface thereof that is in contact with the bottom surface of the body, a recess recessed inward from the surface, and a part of the body enters the recess, and

a width of the recess is smaller at an inlet end of the recess than within the recess.

11. The laminated electronic component according to claim 8 , wherein a thickness of each outer electrode is from about 5 μm to about 100 μm.

12. The laminated electronic component according to claim 8 , wherein an end portion of the coil that is located at a top side of the body is electrically connected to the outer electrode via a connection portion provided at an outer side portion of a wound portion of the coil.

13. The laminated electronic component according to claim 1 , wherein

each outer electrode includes a base electrode layer containing Ag, and one or more plating layers provided on the base electrode layer, and

the base electrode layer has the wedge portion.

14. The laminated electronic component according to claim 13 , wherein

each outer electrode has, on a surface thereof that is in contact with the bottom surface of the body, a recess recessed inward from the surface, and a part of the body enters the recess, and

a width of the recess is smaller at an inlet end of the recess than within the recess.

15. The laminated electronic component according to claim 13 , wherein a thickness of each outer electrode is from about 5 μm to about 100 μm.

16. The laminated electronic component according to claim 1 , wherein

each outer electrode has, on a surface thereof that is in contact with the bottom surface of the body, a recess recessed inward from the surface, and a part of the body enters the recess, and

a width of the recess is smaller at an inlet end of the recess than within the recess.

17. The laminated electronic component according to claim 1 , wherein a thickness of each outer electrode is from about 5 μm to about 100 μm.

18. The laminated electronic component according to claim 1 , wherein an end portion of the coil that is located at a top side of the body is electrically connected to the outer electrode via a connection portion provided at an outer side portion of a wound portion of the coil.