Polishing method, and polishing composition and method for producing the same
A polishing method according to the present invention, includes polishing a polishing object containing a silicon material by using a polishing composition containing abrasive grains, a tri- or more polyvalent hydroxy compound and a dispersing medium and having pH of less than 6.0.
1. A polishing method, comprising polishing a polishing object containing a silicon material by using a polishing composition containing abrasive grains, a tri - or more polyvalent hydroxy compound, and a dispersing medium and having pH of less than 6.0,
wherein the abrasive grains are cation-modified colloidal silica, and
wherein the polishing composition does not comprise an oxidizing agent.
2. The polishing method according to claim 1 , wherein the tri- or more polyvalent hydroxy compound has a molecular weight of 90 or more.
3. The polishing method according to claim 1 , wherein the tri- or more polyvalent hydroxy compound is a sugar alcohol.
4. The polishing method according to claim 1 , wherein the pH is 2.0 or more and 5.5 or less.
5. The polishing method according to claim 1 , wherein the silicon material has an oxygen atom and a silicon atom.
6. The polishing method of claim 1 , wherein the tri- or more polyvalent hydroxy compound is at least one selected from the group consisting of (2R,3R,4S)-pentane-1,2,3,4,5-pentole, (2R,3R,4S,5S)-hexane-1,2,3,4,5,6-hexol, and xylitol.
7. The polishing composition according to claim 1 , wherein the polishing composition does not comprise anion-modified colloidal silica.
8. A polishing method, comprising polishing a polishing object containing a silicon material by using a polishing composition consisting of abrasive grains, a tri - or more polyvalent hydroxy compound, a pH adjusting agent, and a dispersing medium and having pH of less than 6.0,
wherein the abrasive grains are cation-modified colloidal silica,
wherein the polishing composition does not comprise an oxidizing agent.
9. The polishing method according to claim 8 , wherein the tri - or more polyvalent hydroxy compound has a molecular weight of 90 or more.
10. The polishing method according to claim 8 , wherein the tri - or more polyvalent hydroxy compound is a sugar alcohol.
11. The polishing method according to claim 8 , wherein the pH is 2.0 or more and 5.5 or less.
12. The polishing method according to claim 8 , wherein the silicon material has an oxygen atom and a silicon atom.
13. The method of claim 8 , wherein the polishing composition does not comprise anion-modified colloidal silica.
14. A polishing method, comprising polishing a polishing object containing a silicon material by using a polishing composition consisting of abrasive grains, a tri - or more polyvalent hydroxy compound, a pH adjusting agent, an additive, and a dispersing medium and having pH of less than 6.0,
wherein the abrasive grains are cation-modified colloidal silica, and
the additive is at least one selected from the group consisting of antiseptic agents, antifungal agents, and water-soluble polymers.
15. The polishing method according to claim 14 , wherein the tri - or more polyvalent hydroxy compound has a molecular weight of 90 or more.
16. The polishing method according to claim 14 , wherein the tri - or more polyvalent hydroxy compound is a sugar alcohol.
17. The polishing method according to claim 14 , wherein the pH is 2.0 or more and 5.5 or less.
18. The polishing method according to claim 14 , wherein the silicon material has an oxygen atom and a silicon atom.