Laser clearance of coating

1. A method for processing a component, comprising:

removing a first coating from an outer surface of a substrate of the component, the substrate comprising an inner surface, the outer surface, and a first hole extending from the inner surface to the outer surface, an edge of the first hole defined where the first hole interfaces with the outer surface of the substrate;

subsequent to removing the first coating from the outer surface of the substrate, applying a second coating to the outer surface of the substrate, wherein a portion of the second coating at least partially blocks the first hole; and subsequent to applying the second coating to the substrate, removing the portion of the second coating to generate a second hole through the second coating, wherein the removal of the portion of the second coating creates a bore in the second coating that provides a clearance of the second coating, the bore defined by a sidewall of the second coating, the sidewall comprising a sidewall surface extending from an inner side of the second coating in contact with the outer surface of the substrate to an outer side of the second coating which faces away from the substrate, the sidewall surface surrounding the first hole and spaced from the first hole by a width of the bore extending along the outer surface of the substrate from the edge of the first hole to the sidewall surface of the sidewall of the second coating to define the clearance such that the outer surface of the substrate is free of the second coating within the bore over a span of the clearance coinciding with the width; and

wherein the clearance extends around an entire perimeter of the edge of the first hole.

2. The method of claim 1 , wherein the bore has a depth and the second coating has a thickness.

3. The method of claim 2 , wherein the depth is equal to the thickness.

4. The method of claim 1 , wherein the first hole has a first dimension, and wherein the bore has a second dimension.

5. The method of claim 4 , wherein the second dimension is a value within a range of 50-100% of the first dimension.

6. The method of claim 5 , wherein the first dimension is a diameter of the first hole, and wherein the second dimension is the width of the bore.

7. The method of claim 1 , further comprising: identifying a location of the first hole.

8. The method of claim 7 , wherein the location of the first hole is identified subsequent to the removal of the first coating from the substrate and prior to the application of the second coating to the substrate.

9. The method of claim 1 , further comprising:

using a laser to remove the portion of the second coating from the substrate.

10. The method of claim 9 , further comprising:

controlling, during the removing, at least one parameter of the laser based on an identification of the laser.

11. The method of claim 10 , wherein the at least one parameter includes at least one of: a total number of laser pulses, laser power, pulse width, or spot size.

12. The method of claim 1 , wherein the first coating is removed from the substrate using a water-jet.

13. The method of claim 1 , wherein the bore is a counterbore.

14. The method of claim 6 , wherein the bore has a second diameter which is greater than the diameter of the first hole.

15. The method of claim 1 , wherein the sidewall surface extends parallel to a center axis of the first hole from the inner side of the second coating and the outer side of the second coating.

16. The method of claim 1 , wherein the sidewall surface faces a center axis of the first hole and the sidewall surface extends away from the outer surface of the substrate in a direction from the inner side of the second coating to the outer side of the second coating.

17. The method of claim 1 , wherein the width is asymmetrical about the hole.

18. The method of claim 1 , wherein the sidewall is a tapered sidewall.