Stencil structure and method of fabricating package

1. A method of fabricating a package, comprising:

providing a system comprising:

a structure and a vibrator, wherein the structure comprises:

a carrier; and

plates, disposed in a groove of the carrier, wherein each of the plates has a plurality of openings configured to accommodate a plurality of conductive terminals, wherein at least one of the plates is slidably disposed along sidewalls of another plate;

providing the plurality of conductive terminals above the plates, and introducing the plurality of conductive terminals into the plurality of openings of each of the plates by the vibrator;

providing a temporary carrier having a first surface and a second surface opposite to the first surface, wherein connection materials are disposed over the first surface;

turning the first surface of the temporary carrier downward and covering a top surface of the structure;

flipping the temporary carrier and the structure, and then the plurality of conductive terminals in the plates are falling towards the connection materials;

removing the structure;

forming an insulating encapsulation to encapsulate the plurality of conductive terminals; and

grinding the insulating encapsulation.

2. The method of claim 1 , further comprises:

forming a flux on the connection materials; and

reflowing the connection materials so as to connect the connection materials to the plurality of conductive terminals.

3. The method of claim 1 , further comprises:

performing a etch process on the insulating encapsulation to expose a part of sidewalls of the plurality of conductive terminals after grinding the insulating encapsulation.

4. The method of claim 1 , wherein:

a redistribution structure is disposed over the first surface of the temporary carrier, wiring substrates are disposed over the redistribution structure, and the connection materials are disposed over the wiring substrates, wherein the redistribution structure is curved.

5. The method of claim 4 , further comprises:

a singulation process is performed to singulate the redistribution structure to form redistribution circuits;

bonding a semiconductor device on one of the redistribution circuits; and

forming conductive connectors on the plurality of conductive terminals on the redistribution circuits.

6. The method of claim 1 , further comprises:

disposing dies on the first surface of the temporary carrier; and

forming the insulating encapsulation to encapsulate the plurality of conductive terminals and the dies.

7. The method of claim 1 , wherein when flipping the temporary carrier and the structure, the sidewalls of the at least one of the plates slide along the sidewalls of the another plate or along sidewalls of the groove of the carrier.

8. The method of claim 7 , wherein the insulating encapsulation and the plurality of conductive terminals are grinded together, and the plurality of conductive terminals have different thickness after being grinded.

9. A method of fabricating a package, comprising:

providing a system comprising:

a structure and a vibrator, wherein the structure comprises:

a carrier; and

plates, disposed in a groove of the carrier, wherein each of the plates has a plurality of openings configured to accommodate a plurality of conductive terminals, wherein at least one of the plates is slidably disposed along sidewalls of another plate;

providing the plurality of conductive terminals above the plates, and introducing the plurality of conductive terminals into the plurality of openings of each of the plates by the vibrator;

providing a temporary carrier, wherein connection materials are disposed over a first surface of the temporary carrier;

overlapping the temporary carrier and the structure, wherein the first surface of the temporary carrier faces the structure and the connection materials are overlapping with the plurality of openings of the plates;

flipping the temporary carrier and the structure together to dispose the plurality of conductive terminals over the temporary carrier, wherein the sidewalls of the at least one of the plates slide along the sidewalls of the another plate or along sidewalls of the groove of the carrier;

connecting the plurality of conductive terminals and the connection materials;

removing the structure;

forming an insulating encapsulation to encapsulate the plurality of conductive terminals; and

grinding the insulating encapsulation.

10. The method of claim 9 , wherein:

a redistribution structure is disposed over the first surface of the temporary carrier, wiring substrates are disposed over the redistribution structure, and the connection materials are disposed over the wiring substrates.

11. The method of claim 10 , further comprises:

a singulation process is performed to singulate the redistribution structure to form redistribution circuits;

bonding a semiconductor device on one of the redistribution circuits; and

forming conductive connectors on the plurality of conductive terminals on the redistribution circuits.

12. The method of claim 9 , further comprises:

disposing dies on the first surface of the temporary carrier; and

forming the insulating encapsulation to encapsulate the plurality of conductive terminals and the dies, wherein after flipping the temporary carrier and the structure together, a vertical distance between the at least one of the plates and the carrier is increased.

13. A system for transferring a plurality of conductive terminals, comprising:

a structure, comprising:

a carrier having a groove; and

plates, placed in the groove of the carrier, wherein at least one of the plates is slidably disposed along sidewalls of another plate, and each of the plates has a plurality of openings configured to accommodate the plurality of conductive terminals; and

a vibrator configured to introduce the plurality of conductive terminals into the plurality of openings of each of the plates.

14. The system of claim 13 , wherein each of the plurality of openings of the plates has a same size.

15. The system of claim 13 , wherein each of the plurality of openings of the plates has a cylinder shape.

16. The system of claim 13 , wherein the plurality of openings of the plates are through holes of the plates.

17. The system of claim 13 , wherein each of the plates is slidably disposed along sidewalls of an adjacent plate.

18. The system of claim 13 , wherein sidewalls of the at least one of the plates are perpendicular to a bottom surface of the groove of the carrier, wherein the structure is flip on a warped substrate to transfer the plurality of conductive terminals onto the warped substrate.

19. The system of claim 13 , wherein sidewalls of the at least one of the plates are perpendicular to a bottom surface of the groove of the carrier, and wherein a first plate among the plates and a second plate among the plates are located at different level heights when the structure is flip on at least one wiring substrate.

20. The system of claim 13 , wherein the plates are in contact with a bottom surface of the groove of the carrier.