Low inductance power module with vertical power loop structure and insulated baseplates
A low inductance power module with low power loop inductance and high-power density is provided. The power module may include a vertical power loop structure, a cooling layer, and a thermal dissipation structure. The vertical power loop structure may utilize a substrate bottom conduction layer for electrical conduction. The thermal dissipation structure may be disposed between the substrate bottom conduction layer and the cooling layer. The vertical power loop structure may include integrated decoupling capacitors. Alternatively, the structure may include no integrated decoupling capacitors. The vertical power loop structure may include one or more half-bridge structures connected in parallel, each with its own integrated decoupling capacitors. The vertical power loop structure reduces power loop inductance in the power module, and the thermal dissipation structure provides electrical insulation, mechanical support, and thermal conduction.
1. A power module, comprising:
a vertical power loop structure formed within a substrate comprising a substrate bottom negative DC conduction layer for electrical conduction, a substrate top negative DC conduction layer, and vias that provide an electrical interconnection between the substrate bottom negative DC conduction layer and the substrate top negative DC conduction layer;
an AC trace disposed within the substrate;
a positive DC trace disposed within the substrate;
a cooling structure; and
a thermal dissipation structure disposed between the substrate bottom negative DC conduction layer and the cooling structure.
2. The power module of claim 1 , wherein the vertical power loop structure is a half-bridge structure with integrated decoupling capacitors.
3. The power module of claim 1 , wherein the vertical power loop structure is a half-bridge structure without integrated decoupling capacitors.
4. The power module of claim 1 , wherein the vertical power loop structure comprises a plurality of half-bridge structures each with one or more integrated decoupling capacitors.
5. The power module of claim 1 , wherein the vertical power loop structure comprises a plurality of half-bridge structures each without an integrated decoupling capacitor.
6. The power module of claim 1 , wherein the thermal dissipation structure comprises an insulated baseplate.
7. The power module of claim 1 , further comprising conduction layer interconnection bonding technology.
8. The power module of claim 1 , further comprising a material with a high in-plane thermal spreading capability between the substrate bottom conduction layer and the thermal dissipation structure.
9. The power module of claim 1 , further comprising using lamination technology to reduce a stacked layer number of the vertical power loop structure.
10. The power module of claim 9 , wherein the lamination technology comprises low-temperature co-fired ceramics (LTCC).
11. A power module comprising:
a vertical power loop structure formed within a substrate having a substrate bottom negative DC conduction layer, a substrate top negative DC conduction layer, and vias that provide an electrical interconnection between the substrate bottom negative DC conduction layer and the substrate top negative DC conduction layer that is configured to reduce loop stray inductance in the power module;
an AC trace disposed within the substrate;
a positive DC trace disposed within the substrate; and
an insulated baseplate configured to provide electrical insulation and thermal dissipation for the power module.
12. The power module of claim 11 , wherein the vertical power loop structure comprises a plurality of traces that go through a printed circuit board (PCB) inner layer of the vertical power loop structure to reduce a power loop area.
13. The power module of claim 11 , wherein the insulated baseplate is disposed between the substrate bottom conduction layer and a cooling structure.
14. The power module of claim 11 , wherein the vertical power loop structure is a half-bridge structure.
15. The power module of claim 11 , wherein the vertical power loop structure comprises, in parallel, a plurality of half-bridge structures each with one or more integrated decoupling capacitors.
16. The power module of claim 11 , further comprising conduction layer interconnection bonding technology.
17. The power module of claim 11 , further comprising a material with a high in-plane thermal spreading capability between the substrate bottom conduction layer and the thermal dissipation structure.