IP Library › Granted Patent US 11,765,531
Granted Patent B2
US 11,765,531 · App. 17/372,745 · Granted Sep 19, 2023

Hearing aid adapted for embedded electronics

Inventors: Douglas F. Link (Plymouth, MN); David Prchal (Hopkins, MN); Sidney A. Higgins (Maple Grove, MN)
Assignee: Starkey Laboratories, Inc.
H04R25/609H04R25/604H04R25/65H04R25/603
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Quick Facts
Patent No.
US 11,765,531
App. No.
17/372,745
Granted
Sep 19, 2023
Kind
B2
Abstract

A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.

Claims (32)

1. A hearing assistance device comprising:

an insulator;

hearing assistance electronics; and

conductive traces overlaying the insulator; the conductive traces configured to form at least a portion of an antenna and configured to connect to the hearing assistance electronics and to follow non-planar contours of the insulator.

2. The hearing assistance device of claim 1 , wherein the insulator includes at least a portion of a spine of the hearing assistance device.

3. The hearing assistance device of claim 1 , wherein the insulator includes at least a portion of a housing of the hearing assistance device.

4. The hearing assistance device of claim 1 , comprising a passive electrical component coupled to one or more of the conductive traces.

5. The hearing assistance device of claim 1 , comprising an active electrical component coupled to one or more of the conductive traces.

6. The hearing assistance device of claim 1 , wherein the hearing assistance electronics include a plurality of electronic devices, and

wherein an electronic device of the plurality of electronic devices is embedded in the insulator and coupled to one or more of the conductive traces.

7. The hearing assistance device of claim 6 , wherein the electronic device includes a passive surface mount device.

8. The hearing assistance device of claim 6 , wherein the electronic device includes an active device.

9. The hearing assistance device of claim 1 , comprising a contact pad trace array integrated with the insulator, the contact pad trace array having a contact array pattern coupled to the conductive traces and configured to receive an electrical component having a ball grid array (BGA) type packaging.

10. The hearing assistance device of claim 1 , wherein the conductive traces are configured to connect to an antenna.

11. The hearing assistance device of claim 1 , wherein the insulator includes a plastic or a ceramic.

12. The hearing assistance device of claim 1 , wherein the hearing assistance device is a hearing aid.

13. The hearing assistance device of claim 12 , wherein the hearing aid is a behind-the-ear hearing aid.

14. The hearing assistance device of claim 12 , wherein the hearing aid is an in-the-ear hearing aid.

15. The hearing assistance device of claim 12 , wherein the hearing aid is an in-the-canal hearing aid.

16. The hearing assistance device of claim 12 , wherein the hearing aid is a completely-in-the-canal hearing aid.

17. The hearing assistance device of claim 1 , wherein the insulator includes a plurality of internal cavities and the conductive traces include an inter-cavity trace configured to electrically interconnect hearing assistance electronics disposed within at least two of the plurality of internal cavities.

18. A method of manufacturing a hearing assistance device, the method comprising:

overlaying conductive traces on an insulator of the hearing assistance device, the conductive traces configured to form at least a portion of an antenna and configured to follow non-planar contours of the insulator and configured to connect to hearing assistance electronics of the device.

19. The method of claim 18 , wherein overlaying conductive traces includes overlaying multi-axis conductive traces using Molded interconnect Device (MID) technology.

20. The method of claim 18 , wherein overlaying conductive traces includes using conductor-on-insulator (COI) traces.

21. The method of claim 18 , further comprising integrating a contact pad trace array with the insulator, the contact pad trace array having a contact array pattern coupled to the conductive traces and configured to receive an electrical component having a ball grid array (BGA) type packaging.

22. The method of claim 18 , wherein the insulator includes at least a portion of a spine of the hearing assistance device.

23. An ear-wearable device comprising:

an insulator; and

conductive traces overlaying the insulator, the conductive traces forming at least a portion of a radio frequency (RF) antenna.

24. The ear-wearable device of claim 23 , wherein the conductive traces provide tightly controlled and consistent RF characteristics.

25. The ear-wearable device of claim 23 , wherein the device is a hearing aid.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2021
From: LINK, DOUGLAS F.; PRCHAL, DAVID; HIGGINS, SIDNEY A.
To: STARKEY LABORATORIES, INC.
Reel/Frame 057573/0419 →
Continuity (7)
Continuation 16599524 · Oct 11, 2019
Continuation 16058335 · Aug 8, 2018
Continuation 15595302 · May 15, 2017
Continuation 14257537 · Apr 21, 2014
Continuation 12539195 · Aug 11, 2009
Provisional Application 61087899 · Aug 11, 2008
Related Publication 20220007119A1 · Jan 6, 2022
Cited By (1)
US 12,302,071