Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

1. A compound represented by the following formula (17):

2. A method for producing the compound according to claim 1 , comprising a step of reacting an alcohol compound represented by the following formula (4)

with an acid anhydride represented by the following formula (6):

wherein each R 3 independently represents an ethyl group.

3. The production method according to claim 2 , wherein the reaction is carried out in the absence of a catalyst.

4. The production method according to claim 2 , wherein the reaction is performed in at least one solvent selected from the group consisting of a halogen solvent, a ketone solvent, and an ester solvent.

5. The production method according to claim 4 , wherein the solvent is at least one selected from the group consisting of dichloromethane, methyl ethyl ketone, butyl acetate, γ-butyrolactone, and propylene glycol monomethyl ether acetate.

6. A resin composition comprising a compound represented by the following formula (16) and/or a compound represented by the following formula (17):

and

a bismaleimide compound (B) comprising a constituent unit represented by the following formula (7) and maleimide groups at both ends of the molecular chain:

wherein R 4 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 5 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 6 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n 1 independently represents an integer of 1 to 10.

7. The resin composition according to claim 6 , further comprising at least one maleimide compound (C) selected from the group consisting of a compound represented by the following formula (8), a compound represented by the following formula (9), a compound represented by the following formula (10), a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13):

wherein R 7 , R 8 , and R 9 each independently represent a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent;

wherein R 10 , R 11 , and R 12 each independently represent a hydrogen atom, a hydroxyl group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n 2 is an integer of 1 to 10;

wherein each R 13 independently represents a hydrogen atom, a methyl group or an ethyl group, and each R 14 independently represents a hydrogen atom or a methyl group;

wherein each R 15 independently represents a hydrogen atom or a methyl group; and n 3 is an integer of 1 to 10;

wherein each R 16 independently represents a hydrogen atom, a methyl group or an ethyl group; and

wherein each R 17 independently represents a hydrogen atom or a methyl group; and n 4 is an integer of 1 to 10.

8. The resin composition according to claim 6 , further comprising a photo initiator (D).

9. The resin composition according to claim 8 , wherein the photo initiator (D) comprises a compound represented by the following formula (14):

wherein each R 18 independently represents a group represented by the following formula (15) or a phenyl group; and

wherein -* represents a bonding hand, and each R 19 independently represents a hydrogen atom or a methyl group.

10. A resin sheet comprising:

a support; and

a resin layer disposed on one surface or both surfaces of the support,

wherein the resin layer comprises the resin composition according to claim 6 .

11. The resin sheet according to claim 10 , wherein the resin layer has a thickness of 1 to 50 μm.

12. A multilayer printed wiring board comprising:

an insulation layer; and

a conductor layer formed on one surface or both surfaces of the insulation layer,

wherein the insulation layer comprises the resin composition according to claim 6 .

13. A semiconductor device comprising the resin composition according to claim 6 .